BN
Thin Film Process Engineer – Semiconductor Wafer Fabrication
Accepting applicationsBest NanoTech · Ahmedabad, Gujarat, India
Full-Time Mid_senior CVDPVDALDThin Film
Posted
4d ago
Category
Manufacturing
Experience
Mid_senior
Country
India
Thin Film Process Engineer Semiconductor Wafer Fabrication
Location: Ahmedabad, Gujarat, India
Work Mode: Onsite
Experience: 6 15 Years
Role Overview
We are seeking an experienced Thin Film Process Engineer to develop, optimize, qualify, and sustain thin film deposition processes within an advanced semiconductor wafer fabrication facility. This role is responsible for establishing stable deposition processes for dielectric, conductive, barrier, and semiconductor films that meet stringent electrical, physical, and reliability requirements while enabling high-volume semiconductor manufacturing.
The successful candidate will collaborate with Process Integration, Lithography, Etch, CMP, Diffusion, Ion Implant, Yield Engineering, Equipment Engineering, Manufacturing, Metrology, and Quality teams to optimize thin film processes, improve yield, qualify new materials, and support technology ramp-up.
Candidates should possess strong expertise in CVD, PECVD, LPCVD, ALD, PVD, sputtering, epitaxy, film characterization, stress control, and Statistical Process Control (SPC).
Role Objectives
Develop world-class thin film deposition processes.
Achieve excellent film uniformity, composition, thickness, and electrical performance.
Improve manufacturing yield through process optimization.
Support technology transfer and high-volume manufacturing.
Deliver repeatable, scalable, and robust deposition processes.
Key Responsibilities
Develop, optimize, and sustain thin film deposition processes for advanced semiconductor manufacturing.
Establish process windows for dielectric, metal, barrier, and semiconductor film deposition.
Optimize deposition recipes for film thickness, uniformity, stress, step coverage, conformality, resistivity, and adhesion.
Develop and qualify CVD, PECVD, LPCVD, ALD, PVD, sputtering, and epitaxial growth processes.
Evaluate new precursor chemistries, process gases, deposition materials, and consumables.
Perform Design of Experiments (DOE) to optimize film characteristics and process capability.
Analyze metrology, electrical test, and yield data to identify process improvement opportunities.
Drive continuous reduction of particles, film defects, voids, delamination, contamination, and non-uniformity.
Collaborate with Etch, CMP, Lithography, Diffusion, and Process Integration teams to optimize overall process flow.
Support installation, qualification, and acceptance of new deposition equipment.
Develop engineering specifications, process documentation, qualification reports, and standard operating procedures.
Utilize Statistical Process Control (SPC) to monitor process health and stability.
Support Advanced Process Control (APC) implementation for improved manufacturing consistency.
Participate in technology transfer and New Product Introduction (NPI) activities.
Perform root cause analysis for process excursions and yield losses.
Improve throughput, productivity, and manufacturing efficiency.
Ensure compliance with semiconductor quality systems, cleanroom protocols, and EHS standards.
Drive Lean Manufacturing and continuous improvement initiatives.
Key Responsibilities During Fab Startup
Support installation and qualification of thin film deposition tools.
Develop baseline deposition recipes for manufacturing.
Establish process qualification methodologies.
Define process specifications and control plans.
Qualify deposition materials, precursors, and process gases.
Support engineering builds, pilot production, and technology transfer.
Develop manufacturing SOPs and engineering documentation.
Train production personnel on deposition processes.
Improve process capability before production ramp.
Support high-volume manufacturing readiness.
Required Qualifications
Bachelor's or Master's degree in Electronics Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, Semiconductor Engineering, or related discipline.
6 15 years of semiconductor wafer fabrication experience.
Strong expertise in thin film deposition technologies.
Experience supporting advanced semiconductor manufacturing.
Proven expertise in process optimization, technology transfer, and yield improvement.
Excellent analytical, troubleshooting, and communication skills.
Technical Skills Semiconductor Manufacturing
Semiconductor Wafer Fabrication
Front-End Manufacturing (FEOL)
CMOS Process Technology
High Volume Manufacturing (HVM)
Semiconductor Process Development
Technology Transfer
Process Qualification
New Product Introduction (NPI)
Thin Film Deposition Technologies
Chemical Vapor Deposition (CVD)
Plasma Enhanced Chemical Vapor Deposition (PECVD)
Low Pressure Chemical Vapor Deposition (LPCVD)
Atmospheric Pressure CVD (APCVD)
Atomic Layer Deposition (ALD)
Physical Vapor Deposition (PVD)
Magnetron Sputtering
Reactive Sputtering
Thermal Evaporation
Electron Beam Evaporation
Molecular Beam Epitaxy (MBE) (Preferred)
Epitaxial Silicon Growth
Selective Epitaxy
Film Types
Silicon Dioxide (SiO )
Silicon Nitride (Si N )
Polysilicon
Amorphous Silicon
High-k Dielectrics
Low-k Dielectrics
Tungsten
Titanium
Titanium Nitride (TiN)
Tantalum
Tantalum Nitride (TaN)
Copper Seed Layers
Barrier Films
Metal Gate Films
Hard Mask Films
Passivation Layers
Process Materials
Process Precursors
Specialty Gases
Carrier Gases
Plasma Chemistry
Deposition Consumables
Wafer Cleaning Chemistry
Chamber Conditioning
Film Stress Optimization
Thin Film Equipment
Experience With Leading Deposition Platforms Such As
Applied Materials Producer Series
Applied Materials Endura
Lam Research Deposition Systems
ASM Epsilon
ASM Eagle
TEL Deposition Systems
Kokusai Vertical Furnaces
Novellus Systems
Canon Anelva PVD Systems
Process Engineering
Design of Experiments (DOE)
Statistical Process Control (SPC)
Process Capability (Cp/Cpk)
Root Cause Analysis
FMEA
Film Stress Analysis
Yield Improvement
Process Characterization
Process Window Development
Defect Reduction
Metrology
Ellipsometry
Film Thickness Measurement
X-Ray Reflectometry (XRR)
X-Ray Diffraction (XRD)
Four-Point Probe
Stress Measurement
Optical Inspection
SEM Analysis
TEM Analysis (Preferred)
Surface Profilometry
Defect Inspection
Particle Inspection
Data Analysis
JMP
Python
MATLAB
SQL
Microsoft Excel
Statistical Analysis
Data Visualization
Cross Functional Collaboration
The Thin Film Process Engineer Will Work Closely With
Process Integration Engineering
Lithography Engineering
Etch Engineering
CMP Engineering
Diffusion Engineering
Ion Implant Engineering
Equipment Engineering
Yield Engineering
Manufacturing Engineering
Metrology Engineering
Product Engineering
Failure Analysis
Quality Engineering
Automation Engineering
Facilities Engineering
Preferred Industry Experience
Experience In Semiconductor Manufacturing For
Logic Devices
Memory Devices
Foundry Manufacturing
Analog & Mixed-Signal ICs
Power Semiconductor Devices
RF Technologies
Advanced CMOS Manufacturing
Candidates with experience in greenfield fab startups, advanced technology nodes (28nm and below), or high-volume manufacturing environments are highly preferred.
#LI-SD1
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Location: Ahmedabad, Gujarat, India
Work Mode: Onsite
Experience: 6 15 Years
Role Overview
We are seeking an experienced Thin Film Process Engineer to develop, optimize, qualify, and sustain thin film deposition processes within an advanced semiconductor wafer fabrication facility. This role is responsible for establishing stable deposition processes for dielectric, conductive, barrier, and semiconductor films that meet stringent electrical, physical, and reliability requirements while enabling high-volume semiconductor manufacturing.
The successful candidate will collaborate with Process Integration, Lithography, Etch, CMP, Diffusion, Ion Implant, Yield Engineering, Equipment Engineering, Manufacturing, Metrology, and Quality teams to optimize thin film processes, improve yield, qualify new materials, and support technology ramp-up.
Candidates should possess strong expertise in CVD, PECVD, LPCVD, ALD, PVD, sputtering, epitaxy, film characterization, stress control, and Statistical Process Control (SPC).
Role Objectives
Develop world-class thin film deposition processes.
Achieve excellent film uniformity, composition, thickness, and electrical performance.
Improve manufacturing yield through process optimization.
Support technology transfer and high-volume manufacturing.
Deliver repeatable, scalable, and robust deposition processes.
Key Responsibilities
Develop, optimize, and sustain thin film deposition processes for advanced semiconductor manufacturing.
Establish process windows for dielectric, metal, barrier, and semiconductor film deposition.
Optimize deposition recipes for film thickness, uniformity, stress, step coverage, conformality, resistivity, and adhesion.
Develop and qualify CVD, PECVD, LPCVD, ALD, PVD, sputtering, and epitaxial growth processes.
Evaluate new precursor chemistries, process gases, deposition materials, and consumables.
Perform Design of Experiments (DOE) to optimize film characteristics and process capability.
Analyze metrology, electrical test, and yield data to identify process improvement opportunities.
Drive continuous reduction of particles, film defects, voids, delamination, contamination, and non-uniformity.
Collaborate with Etch, CMP, Lithography, Diffusion, and Process Integration teams to optimize overall process flow.
Support installation, qualification, and acceptance of new deposition equipment.
Develop engineering specifications, process documentation, qualification reports, and standard operating procedures.
Utilize Statistical Process Control (SPC) to monitor process health and stability.
Support Advanced Process Control (APC) implementation for improved manufacturing consistency.
Participate in technology transfer and New Product Introduction (NPI) activities.
Perform root cause analysis for process excursions and yield losses.
Improve throughput, productivity, and manufacturing efficiency.
Ensure compliance with semiconductor quality systems, cleanroom protocols, and EHS standards.
Drive Lean Manufacturing and continuous improvement initiatives.
Key Responsibilities During Fab Startup
Support installation and qualification of thin film deposition tools.
Develop baseline deposition recipes for manufacturing.
Establish process qualification methodologies.
Define process specifications and control plans.
Qualify deposition materials, precursors, and process gases.
Support engineering builds, pilot production, and technology transfer.
Develop manufacturing SOPs and engineering documentation.
Train production personnel on deposition processes.
Improve process capability before production ramp.
Support high-volume manufacturing readiness.
Required Qualifications
Bachelor's or Master's degree in Electronics Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, Semiconductor Engineering, or related discipline.
6 15 years of semiconductor wafer fabrication experience.
Strong expertise in thin film deposition technologies.
Experience supporting advanced semiconductor manufacturing.
Proven expertise in process optimization, technology transfer, and yield improvement.
Excellent analytical, troubleshooting, and communication skills.
Technical Skills Semiconductor Manufacturing
Semiconductor Wafer Fabrication
Front-End Manufacturing (FEOL)
CMOS Process Technology
High Volume Manufacturing (HVM)
Semiconductor Process Development
Technology Transfer
Process Qualification
New Product Introduction (NPI)
Thin Film Deposition Technologies
Chemical Vapor Deposition (CVD)
Plasma Enhanced Chemical Vapor Deposition (PECVD)
Low Pressure Chemical Vapor Deposition (LPCVD)
Atmospheric Pressure CVD (APCVD)
Atomic Layer Deposition (ALD)
Physical Vapor Deposition (PVD)
Magnetron Sputtering
Reactive Sputtering
Thermal Evaporation
Electron Beam Evaporation
Molecular Beam Epitaxy (MBE) (Preferred)
Epitaxial Silicon Growth
Selective Epitaxy
Film Types
Silicon Dioxide (SiO )
Silicon Nitride (Si N )
Polysilicon
Amorphous Silicon
High-k Dielectrics
Low-k Dielectrics
Tungsten
Titanium
Titanium Nitride (TiN)
Tantalum
Tantalum Nitride (TaN)
Copper Seed Layers
Barrier Films
Metal Gate Films
Hard Mask Films
Passivation Layers
Process Materials
Process Precursors
Specialty Gases
Carrier Gases
Plasma Chemistry
Deposition Consumables
Wafer Cleaning Chemistry
Chamber Conditioning
Film Stress Optimization
Thin Film Equipment
Experience With Leading Deposition Platforms Such As
Applied Materials Producer Series
Applied Materials Endura
Lam Research Deposition Systems
ASM Epsilon
ASM Eagle
TEL Deposition Systems
Kokusai Vertical Furnaces
Novellus Systems
Canon Anelva PVD Systems
Process Engineering
Design of Experiments (DOE)
Statistical Process Control (SPC)
Process Capability (Cp/Cpk)
Root Cause Analysis
FMEA
Film Stress Analysis
Yield Improvement
Process Characterization
Process Window Development
Defect Reduction
Metrology
Ellipsometry
Film Thickness Measurement
X-Ray Reflectometry (XRR)
X-Ray Diffraction (XRD)
Four-Point Probe
Stress Measurement
Optical Inspection
SEM Analysis
TEM Analysis (Preferred)
Surface Profilometry
Defect Inspection
Particle Inspection
Data Analysis
JMP
Python
MATLAB
SQL
Microsoft Excel
Statistical Analysis
Data Visualization
Cross Functional Collaboration
The Thin Film Process Engineer Will Work Closely With
Process Integration Engineering
Lithography Engineering
Etch Engineering
CMP Engineering
Diffusion Engineering
Ion Implant Engineering
Equipment Engineering
Yield Engineering
Manufacturing Engineering
Metrology Engineering
Product Engineering
Failure Analysis
Quality Engineering
Automation Engineering
Facilities Engineering
Preferred Industry Experience
Experience In Semiconductor Manufacturing For
Logic Devices
Memory Devices
Foundry Manufacturing
Analog & Mixed-Signal ICs
Power Semiconductor Devices
RF Technologies
Advanced CMOS Manufacturing
Candidates with experience in greenfield fab startups, advanced technology nodes (28nm and below), or high-volume manufacturing environments are highly preferred.
#LI-SD1
Show more Show less