KS
Application Engineer
Accepting applicationsKelly Science, Engineering, Technology & Telecom · Billerica, MA
Full-Time Associate AI
Posted
1d ago
Category
Manufacturing
Experience
Associate
Country
United States
Kelly Engineering is partnering with a leader in advanced materials innovation to identify a talented Senior Applications Engineer to drive the adoption of next-generation thermal interface solutions. If you thrive at the crossroads of engineering, customer engagement, and real-world problem solving, we want to hear from you!
Position Overview
In this dynamic role, you will act as the primary technical interface for our customers as they evaluate and implement our high-performance thermal interface materials (TIM). You will lead early- and mid-stage customer interactions, translate customer requirements into actionable engineering plans, and play a pivotal role in the integration and qualification of TIMs in advanced semiconductor packaging—including AI and data center applications.
Key Responsibilities
Design & Integration: Lead technical efforts to integrate liquid-metal based TIMs into customer-specific packages.
Prototyping & Testing: Build, test, and document mockups—manage the fabrication of prototypes to support customer schedules.
Customer Support: Serve as primary technical point of contact for hyperscalers, ODMs, and OSATs during engagement and integration phases.
Technical Documentation: Prepare application notes, design guides, and technical reports to support customer validation and qualification.
Cross-Functional Leadership: Collaborate with R&D, manufacturing, business development, and quality to resolve technical issues and improve product performance.
Feedback & Roadmapping: Capture and synthesize customer feedback to steer internal product development and guide future innovations.
Required Qualifications
Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
3+ years’ experience in semiconductor packaging, electronics assembly, TIMs, or applications engineering within a technical B2B environment.
Proficiency with CAD modeling, prototyping, and hands-on mechanical and thermal testing.
Strong understanding of processor packaging/thermal design and reliability validation (e.g., cold plate design, TIM selection, uHAST, TCT, HTS).
Track record of leading cross-functional technical projects and delivering timely, customer-focused solutions.
Excellent verbal and written communication skills for both technical and non-technical audiences.
Preferred Qualifications
Experience with elastomeric material design and fabrication.
Familiarity with advanced testing and analysis tools (thermal test setups, C-SAM, X-ray imaging, FEA modeling).
Background supporting hyperscalers, ODMs, OSATs, or semiconductor customers.
Experience producing technical content for diverse stakeholders.
Additional Information
Applicants must be currently authorized to work in the US on a full-time basis.
This role offers the opportunity to influence tomorrow’s electronic systems – join us to solve key challenges in the semiconductor and electronics industry!
Ready to take your engineering career to the next level? Apply today!
Show more Show less
Position Overview
In this dynamic role, you will act as the primary technical interface for our customers as they evaluate and implement our high-performance thermal interface materials (TIM). You will lead early- and mid-stage customer interactions, translate customer requirements into actionable engineering plans, and play a pivotal role in the integration and qualification of TIMs in advanced semiconductor packaging—including AI and data center applications.
Key Responsibilities
Design & Integration: Lead technical efforts to integrate liquid-metal based TIMs into customer-specific packages.
Prototyping & Testing: Build, test, and document mockups—manage the fabrication of prototypes to support customer schedules.
Customer Support: Serve as primary technical point of contact for hyperscalers, ODMs, and OSATs during engagement and integration phases.
Technical Documentation: Prepare application notes, design guides, and technical reports to support customer validation and qualification.
Cross-Functional Leadership: Collaborate with R&D, manufacturing, business development, and quality to resolve technical issues and improve product performance.
Feedback & Roadmapping: Capture and synthesize customer feedback to steer internal product development and guide future innovations.
Required Qualifications
Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
3+ years’ experience in semiconductor packaging, electronics assembly, TIMs, or applications engineering within a technical B2B environment.
Proficiency with CAD modeling, prototyping, and hands-on mechanical and thermal testing.
Strong understanding of processor packaging/thermal design and reliability validation (e.g., cold plate design, TIM selection, uHAST, TCT, HTS).
Track record of leading cross-functional technical projects and delivering timely, customer-focused solutions.
Excellent verbal and written communication skills for both technical and non-technical audiences.
Preferred Qualifications
Experience with elastomeric material design and fabrication.
Familiarity with advanced testing and analysis tools (thermal test setups, C-SAM, X-ray imaging, FEA modeling).
Background supporting hyperscalers, ODMs, OSATs, or semiconductor customers.
Experience producing technical content for diverse stakeholders.
Additional Information
Applicants must be currently authorized to work in the US on a full-time basis.
This role offers the opportunity to influence tomorrow’s electronic systems – join us to solve key challenges in the semiconductor and electronics industry!
Ready to take your engineering career to the next level? Apply today!
Show more Show less