BN
Ion Implant Process Engineer – Semiconductor Wafer Fabrication
Accepting applicationsBest NanoTech · Ahmedabad, Gujarat, India
Full-Time Mid_senior Ion ImplantDoping
Posted
4d ago
Category
Manufacturing
Experience
Mid_senior
Country
India
Ion Implant Process Engineer Semiconductor Wafer Fabrication
Location: Ahmedabad, Gujarat, India
Work Mode: Onsite
Experience: 6 -15 Years
Role Overview
We are seeking an experienced Ion Implant Process Engineer to develop, optimize, qualify, and sustain ion implantation processes within an advanced semiconductor wafer fabrication facility. This role is responsible for establishing highly controlled dopant implantation processes that meet device performance, junction depth, uniformity, yield, and reliability requirements while supporting advanced CMOS technology and high-volume manufacturing.
The successful candidate will work closely with Process Integration, Diffusion, Lithography, Thin Film, Etch, CMP, Device Engineering, Yield Engineering, Equipment Engineering, Manufacturing, Metrology, and Quality teams to optimize implant processes, improve electrical performance, reduce process variation, and support technology ramp-up.
Candidates should possess strong expertise in ion implantation, beam tuning, dopant engineering, implant damage control, process characterization, Statistical Process Control (SPC), and semiconductor manufacturing.
Role Objectives
Develop robust ion implantation processes for advanced semiconductor manufacturing.
Achieve excellent dopant profile accuracy and implantation uniformity.
Improve device performance through optimized implantation strategies.
Support technology transfer and production ramp.
Deliver stable, repeatable, and scalable implant manufacturing processes.
Key Responsibilities
Develop, optimize, and sustain ion implantation processes for semiconductor wafer fabrication.
Establish process windows for NMOS, PMOS, well, source/drain, halo, extension, threshold adjustment, and channel implantation.
Optimize implantation energy, dose, beam current, tilt angle, twist angle, wafer temperature, and process recipes.
Develop implant strategies to achieve target junction depth, sheet resistance, dopant concentration, and electrical characteristics.
Evaluate implant damage, crystal defects, channeling effects, and amorphization.
Collaborate with Diffusion Process Engineering to optimize dopant activation and annealing.
Perform Design of Experiments (DOE) to optimize implant parameters and process capability.
Analyze implant metrology, electrical test data, SIMS profiles, sheet resistance measurements, and yield trends.
Support Process Integration activities across Lithography, Thin Film, Diffusion, Etch, and CMP modules.
Collaborate with Equipment Engineering to improve implanter uptime, beam stability, repeatability, and productivity.
Qualify new implant recipes, beam configurations, process gases, and consumables.
Support installation, qualification, and acceptance testing of ion implantation equipment.
Utilize Statistical Process Control (SPC) methodologies to monitor process stability.
Perform root cause analysis for process excursions and yield losses.
Support Advanced Process Control (APC) implementation.
Develop engineering specifications, process documentation, and standard operating procedures.
Participate in technology transfer and New Product Introduction (NPI) activities.
Improve manufacturing yield, throughput, cycle time, and process capability.
Ensure compliance with semiconductor quality systems, cleanroom protocols, radiation safety, and EHS standards.
Drive Lean Manufacturing and continuous improvement initiatives.
Key Responsibilities During Fab Startup
Support installation and qualification of ion implantation systems.
Develop baseline implant recipes for technology qualification.
Establish beam tuning, calibration, and process certification procedures.
Define implant process specifications and control plans.
Qualify implant consumables and specialty gases.
Support engineering lots, pilot production, and technology transfer.
Develop manufacturing documentation and operating procedures.
Train manufacturing teams on implant process operations.
Improve process capability before production ramp.
Support high-volume manufacturing readiness.
Required Qualifications
Bachelor's or Master's degree in Electronics Engineering, Electrical Engineering, Physics, Materials Science, Chemical Engineering, Semiconductor Engineering, or related discipline.
6- 15 years of semiconductor wafer fabrication experience.
Strong hands-on expertise in ion implantation processes.
Experience supporting advanced semiconductor manufacturing.
Proven expertise in process optimization, technology transfer, and yield improvement.
Excellent analytical, troubleshooting, and communication skills.
Technical Skills Semiconductor Manufacturing
Semiconductor Wafer Fabrication
Front-End Manufacturing (FEOL)
CMOS Process Technology
High Volume Manufacturing (HVM)
Semiconductor Process Development
Technology Transfer
Process Qualification
New Product Introduction (NPI)
Ion Implant Process Expertise
Ion Implantation
Dopant Engineering
Source/Drain Implant
Well Implant
Halo Implant
Pocket Implant
Extension Implant
Threshold Voltage Adjustment Implant
High Energy Implant
Medium Current Implant
High Current Implant
Beam Tuning
Beam Alignment
Implant Dose Control
Implant Energy Optimization
Junction Engineering
Channeling Control
Crystal Damage Analysis
Implant Uniformity Optimization
Wafer Charging Control
Dopant Materials
Boron (B)
Phosphorus (P)
Arsenic (As)
BF
Antimony (Sb)
Germanium (Ge) Pre-Amorphization Implant
Carbon Implantation
Specialty Dopant Species
Implant Equipment
Experience With Leading Semiconductor Ion Implantation Systems Such As
Applied Materials Varian VIISta Series
Axcelis GSD Series
Axcelis Purion Series
Nissin Ion Implanters
Sumitomo Heavy Industries Implant Systems
Process Engineering
Design of Experiments (DOE)
Statistical Process Control (SPC)
Process Capability (Cp/Cpk)
Root Cause Analysis
FMEA
Yield Improvement
Process Characterization
Implant Profile Optimization
Defect Reduction
Process Window Development
Metrology
SIMS (Secondary Ion Mass Spectrometry)
Four-Point Probe
Sheet Resistance Measurement
Junction Depth Measurement
Electrical Parametric Testing
Defect Inspection
Particle Inspection
Optical Inspection
Surface Profilometry
Data Analysis
JMP
Python
MATLAB
SQL
Microsoft Excel
Statistical Analysis
Data Visualization
Cross Functional Collaboration
The Ion Implant Process Engineer Will Work Closely With
Process Integration Engineering
Diffusion Engineering
Thin Film Engineering
Lithography Engineering
Etch Engineering
CMP Engineering
Device Engineering
Equipment Engineering
Yield Engineering
Manufacturing Engineering
Metrology Engineering
Product Engineering
Failure Analysis
Quality Engineering
Facilities Engineering
Automation Engineering
Preferred Industry Experience
Experience In Semiconductor Manufacturing For
Logic Devices
Memory Devices
Foundry Manufacturing
Analog & Mixed-Signal ICs
Power Semiconductor Devices
RF Technologies
Advanced CMOS Manufacturing
Candidates with experience in greenfield semiconductor fab startups, advanced technology nodes (28nm and below), FinFET technologies, or high-volume manufacturing environments are highly preferred.
#LI-SD1
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Location: Ahmedabad, Gujarat, India
Work Mode: Onsite
Experience: 6 -15 Years
Role Overview
We are seeking an experienced Ion Implant Process Engineer to develop, optimize, qualify, and sustain ion implantation processes within an advanced semiconductor wafer fabrication facility. This role is responsible for establishing highly controlled dopant implantation processes that meet device performance, junction depth, uniformity, yield, and reliability requirements while supporting advanced CMOS technology and high-volume manufacturing.
The successful candidate will work closely with Process Integration, Diffusion, Lithography, Thin Film, Etch, CMP, Device Engineering, Yield Engineering, Equipment Engineering, Manufacturing, Metrology, and Quality teams to optimize implant processes, improve electrical performance, reduce process variation, and support technology ramp-up.
Candidates should possess strong expertise in ion implantation, beam tuning, dopant engineering, implant damage control, process characterization, Statistical Process Control (SPC), and semiconductor manufacturing.
Role Objectives
Develop robust ion implantation processes for advanced semiconductor manufacturing.
Achieve excellent dopant profile accuracy and implantation uniformity.
Improve device performance through optimized implantation strategies.
Support technology transfer and production ramp.
Deliver stable, repeatable, and scalable implant manufacturing processes.
Key Responsibilities
Develop, optimize, and sustain ion implantation processes for semiconductor wafer fabrication.
Establish process windows for NMOS, PMOS, well, source/drain, halo, extension, threshold adjustment, and channel implantation.
Optimize implantation energy, dose, beam current, tilt angle, twist angle, wafer temperature, and process recipes.
Develop implant strategies to achieve target junction depth, sheet resistance, dopant concentration, and electrical characteristics.
Evaluate implant damage, crystal defects, channeling effects, and amorphization.
Collaborate with Diffusion Process Engineering to optimize dopant activation and annealing.
Perform Design of Experiments (DOE) to optimize implant parameters and process capability.
Analyze implant metrology, electrical test data, SIMS profiles, sheet resistance measurements, and yield trends.
Support Process Integration activities across Lithography, Thin Film, Diffusion, Etch, and CMP modules.
Collaborate with Equipment Engineering to improve implanter uptime, beam stability, repeatability, and productivity.
Qualify new implant recipes, beam configurations, process gases, and consumables.
Support installation, qualification, and acceptance testing of ion implantation equipment.
Utilize Statistical Process Control (SPC) methodologies to monitor process stability.
Perform root cause analysis for process excursions and yield losses.
Support Advanced Process Control (APC) implementation.
Develop engineering specifications, process documentation, and standard operating procedures.
Participate in technology transfer and New Product Introduction (NPI) activities.
Improve manufacturing yield, throughput, cycle time, and process capability.
Ensure compliance with semiconductor quality systems, cleanroom protocols, radiation safety, and EHS standards.
Drive Lean Manufacturing and continuous improvement initiatives.
Key Responsibilities During Fab Startup
Support installation and qualification of ion implantation systems.
Develop baseline implant recipes for technology qualification.
Establish beam tuning, calibration, and process certification procedures.
Define implant process specifications and control plans.
Qualify implant consumables and specialty gases.
Support engineering lots, pilot production, and technology transfer.
Develop manufacturing documentation and operating procedures.
Train manufacturing teams on implant process operations.
Improve process capability before production ramp.
Support high-volume manufacturing readiness.
Required Qualifications
Bachelor's or Master's degree in Electronics Engineering, Electrical Engineering, Physics, Materials Science, Chemical Engineering, Semiconductor Engineering, or related discipline.
6- 15 years of semiconductor wafer fabrication experience.
Strong hands-on expertise in ion implantation processes.
Experience supporting advanced semiconductor manufacturing.
Proven expertise in process optimization, technology transfer, and yield improvement.
Excellent analytical, troubleshooting, and communication skills.
Technical Skills Semiconductor Manufacturing
Semiconductor Wafer Fabrication
Front-End Manufacturing (FEOL)
CMOS Process Technology
High Volume Manufacturing (HVM)
Semiconductor Process Development
Technology Transfer
Process Qualification
New Product Introduction (NPI)
Ion Implant Process Expertise
Ion Implantation
Dopant Engineering
Source/Drain Implant
Well Implant
Halo Implant
Pocket Implant
Extension Implant
Threshold Voltage Adjustment Implant
High Energy Implant
Medium Current Implant
High Current Implant
Beam Tuning
Beam Alignment
Implant Dose Control
Implant Energy Optimization
Junction Engineering
Channeling Control
Crystal Damage Analysis
Implant Uniformity Optimization
Wafer Charging Control
Dopant Materials
Boron (B)
Phosphorus (P)
Arsenic (As)
BF
Antimony (Sb)
Germanium (Ge) Pre-Amorphization Implant
Carbon Implantation
Specialty Dopant Species
Implant Equipment
Experience With Leading Semiconductor Ion Implantation Systems Such As
Applied Materials Varian VIISta Series
Axcelis GSD Series
Axcelis Purion Series
Nissin Ion Implanters
Sumitomo Heavy Industries Implant Systems
Process Engineering
Design of Experiments (DOE)
Statistical Process Control (SPC)
Process Capability (Cp/Cpk)
Root Cause Analysis
FMEA
Yield Improvement
Process Characterization
Implant Profile Optimization
Defect Reduction
Process Window Development
Metrology
SIMS (Secondary Ion Mass Spectrometry)
Four-Point Probe
Sheet Resistance Measurement
Junction Depth Measurement
Electrical Parametric Testing
Defect Inspection
Particle Inspection
Optical Inspection
Surface Profilometry
Data Analysis
JMP
Python
MATLAB
SQL
Microsoft Excel
Statistical Analysis
Data Visualization
Cross Functional Collaboration
The Ion Implant Process Engineer Will Work Closely With
Process Integration Engineering
Diffusion Engineering
Thin Film Engineering
Lithography Engineering
Etch Engineering
CMP Engineering
Device Engineering
Equipment Engineering
Yield Engineering
Manufacturing Engineering
Metrology Engineering
Product Engineering
Failure Analysis
Quality Engineering
Facilities Engineering
Automation Engineering
Preferred Industry Experience
Experience In Semiconductor Manufacturing For
Logic Devices
Memory Devices
Foundry Manufacturing
Analog & Mixed-Signal ICs
Power Semiconductor Devices
RF Technologies
Advanced CMOS Manufacturing
Candidates with experience in greenfield semiconductor fab startups, advanced technology nodes (28nm and below), FinFET technologies, or high-volume manufacturing environments are highly preferred.
#LI-SD1
Show more Show less