Micron
377 open semiconductor roles on SiliconBoard
Open positions at Micron
Senior Engineer - HBM Design for Test (DFT)
Richardson, United States, North America
Principal Engineer, High‑Speed RTL Design
Bangalore, India, Asia
PRINCIPAL RTL DESIGN
Boise, United States, North America
Principal/MTS, Analog Design Engineering
Boise, United States, North America
HBM SoC Physical Design Engineer
Folsom, United States, North America
Principal Engineer, ASIC Analog Design
Bangalore, India, Asia
New College Grad - EDA/CAD Engineer
2 Locations
MTS - Analog Design
Bangalore, India, Asia
Principal Engineer - Analog Design
Bangalore, India, Asia
Senior Engineer - Analog Design
Bangalore, India, Asia
MTS – ASIC Silicon Debug, Device Technology & Yield Engineering
2 Locations
HBM Media Health Product Engineer (DFT)
Boise, United States, North America
MANUFACTURING SHIFT LEAD - PHOTOLITHOGRAPHY
Boise, United States, North America
Staff / Principal Wafer Bond Process Development Engineer
Boise, United States, North America
SoC Static Timing Analysis (STA) Engineer, HBM
2 Locations
Senior RTL design engineer
Hyderabad, India, Asia
Principal Engineer, ASIC Design
San Jose, United States, North America
ASIC Design Verification Engineer
Minneapolis, United States, North America
SR ENGR, FE CENTRAL WAFER LEVEL QUALITY
Singapore, Singapore, Asia
Senior Engineer - HBM Analog Design
Bangalore, India, Asia
MTS DRAM ASIC Architect
Bangalore, India, Asia
Staff Analog Design Engineer
Boise, United States, North America
Principal Analog Design Engineer
Boise, United States, North America
ASIC Design Engineer
MIL - Be'er Sheva Negev Park - Office
Wafer Probe Integration Engineer
Boise, United States, North America
Staff Engineer, PCIE ASIC Validation
Hyderabad, India, Asia
ID1 EUV Photolithography Senior Process Engineer
Boise, United States, North America
Staff Engineer , Analog Design
Bangalore, India, Asia
Staff Engineer - ASIC Physical Design
Bangalore, India, Asia
ASIC RA Engineer
Taichung - Mtb, Taiwan, Asia
Senior ASIC Test Engineer
2 Locations
Staff/Principal Engineer - HBM Design for Test (DFT)
Richardson, United States, North America
Staff engineer , ASIC AMS Verification
2 Locations
STAFF ENGINEER, ASIC Design
Hyderabad, India, Asia
Manager, ASIC DV
Hyderabad, India, Asia
Senior/Engineer, NAND Wafer Level Reliability & Design
Singapore, Singapore, Asia
Design Engineer, HBM DFT
Richardson, United States, North America
ENGINEER, APTD Wafer Thinning / CMP process
Taichung, Taiwan, Asia
Staff Design Verification Engineer, HBM Architecture
Richardson, United States, North America
Dry Etch Principal Process Development Engineer
Boise, United States, North America
Sr. ASIC Design Engineer
San Jose, United States, North America
New College Grad - HBM Layout Engineer
Jalisco, Mexico, North America
SR Layout Engineer, DEG
Boise, United States, North America
Principal Engineer - Memory Circuit Design Verification
Hyderabad, India, Asia
Staff Engineer, ASIC Design Verification
Hyderabad, India, Asia
Test Engineer Assistant
Taichung - Aatt, Taiwan, Asia
Fab10 FAC Electrical Principal Engineer
Singapore, Singapore, Asia
Staff Engineer, ASIC Physical Design
Hyderabad, India, Asia
Staff Engineer - ASIC SOC Verification
Hyderabad - Skyview, India, Asia
Snr Engineer/Engineer FE Global PLN Strategic & Modeling
Singapore, Singapore, Asia
ENGINEER, FW & PRODUCT TEST ENGINEERING
Arzano, Italy, Europe
SoC Architecture and Design Engineer, Senior Member of Technical Staff (SMTS)
2 Locations
ENGINEER, SCANNER EQUIPMENT
Taichung, Taiwan, Asia
HVM Production Operator (Tainan)
Tainan, Taiwan, Asia
HVM Production Supervisor (Tainan)
Tainan, Taiwan, Asia
Senior Layout Engineer - DPG Layout
Hyderabad, India, Asia
Staff/ Principal Engineer, OCT MTE Material Engineering
2 Locations
Fab15 CMP Process & Equipment Engineer
Hiroshima, Japan, Asia
SoC Physical Design Engineer, Senior Member of Technical Staff (SMTS)
2 Locations
Director – Package Materials Integration, APTD
Boise, United States, North America
Senior Engineer, TD Device Characterization
Hyderabad, India, Asia
F16N_HVM _ Production/ Equipment/ Process Engineer
Miaoli - Tongluo, Taiwan, Asia
Principal Customer Integration Engineer, Product & Process Engineering (HBM)
Boise, United States, North America
Staff Process Engineer, APTD Bonding
Boise, United States, North America
Equipment Technician, Advanced Packaging
Boise, United States, North America
Process Technician, Advanced Packaging
Boise, United States, North America
Sr Engineer/Layout Engineer, Memory CAD, Guadalajara
Jalisco, Mexico, North America
Principal Engineer – HBM Design for Test (DFT)
Richardson, United States, North America
FPGA Prototyping & Emulation Developer - SMTS/MTS
2 Locations
Material Handler
Singapore, Singapore, Asia
Sr Category Supplier Manager
Penang, Malaysia, Asia
Graduate Engineering Technician, CSM
Sanand - 303A - At/Ssd/Mod, India, Asia
Senior Engineer - ASIC Verification
Hyderabad, India, Asia
Staff Engineer - ASIC Verification
2 Locations
Design Verification Engineer
Boise, United States, North America
Taiwan Fab Equip Maintenance Engineer
Taichung, Taiwan, Asia
DRAM Design Tech Layout Engineer
Jalisco, Mexico, North America
DRAM Design Technology Layout Engineer
Jalisco, Mexico, North America
Staff SoC DFT Engineer, HBM
Richardson, United States, North America
Principal AMS Verification Engineer
Hyderabad, India, Asia
Senior Engineer IP Verification - AMS Verification
Bangalore, India, Asia
Principal Analog Design Engineer, HBM
Richardson, United States, North America
Production Scheduler Enhancement Engineer/生産計画（スケジューリング）改善エンジニア
Hiroshima, Japan, Asia
MTS-RTL Verification Engineer
Bangalore, India, Asia
Sr Engineer, TD Device Characterizations
Boise, United States, North America
Sr. Category Supplier Manager II, Facilities Procurement
Singapore, Singapore, Asia
Layout Engineer
Singapore, Singapore, Asia
Fab10 Facilities Construction Document and Cost Control Engineer
Singapore, Singapore, Asia
MATERIAL ENGINEER, ADVANCED PACKAGING TECHNOLOGY DEVELOPMENT
Taichung, Taiwan, Asia
MTB HBM Manufacturing Engineer
Taichung - Mtb, Taiwan, Asia
Senior SOC Physical Design Engineer, HBM
Richardson, United States, North America
HBM SoC RTL Design Engineer
Folsom, United States, North America
Intern - AI‑Driven Process Development Deposition & Ion implantation
Singapore, Singapore, Asia
Manager - Manufacturing Execution Systems (MES)
Sanand - 303A - At/Ssd/Mod, India, Asia
Sr. Manager - Test Manufacturing
Sanand - 303A - At/Ssd/Mod, India, Asia
Sr. Manager - CAT Assembly Manufacturing
Sanand - 303A - At/Ssd/Mod, India, Asia
Assembly & Test Quality & Data Engineer
Taichung - Mtb, Taiwan, Asia
Staff HBM Design Architect - DFT
2 Locations
New College Grad - Photolithography Process Engineer
Boise, United States, North America
Front End Procurement Supplier Development Manager, Materials
Hiroshima, Japan, Asia
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