Principal Analog Design Engineer, HBM
Accepting applicationsMicron · Richardson, United States, North America
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role is critical in developing and integrating high-performance analog subsystems within the HBM logic die, enabling industry-leading bandwidth, power efficiency, and reliability.
As a principal engineer, you will provide deep technical leadership across analog design, IP integration, system alignment, and silicon execution, driving end-to-end success of HBM solutions.
Responsibilities will include, but are not limited to:
Lead the design and own critical HBM analog circuits, including:
High‑speed transmitters and receivers
Clock generation and distribution (PLLs, DLLs, CDRs)
SerDes‑related analog blocks
Biasing, reference, and calibration circuits
Power delivery and regulation circuits (LDOs, regulators)
Define and lead IP interfaces, power domains, clocking schemes, and reset strategies across subsystems
Perform detailed pre‑layout and post‑layout simulations
Conduct PVT, Monte Carlo, mismatch, and aging analyses
Work closely with layout engineers to define floorplanning and symmetry requirements, ensure matching, shielding, and EM/IR compliance
Review and sign off on analog layouts
Drive layout‑aware build optimizations for advanced nodes
Define guidelines for analog build, documentation, and reuse
Collaborate across analog, digital, system, packaging, and test teams
Minimum Qualifications:
MS or PhD in Electrical Engineering or related field
~10–15+ years of experience in analog/mixed-signal IC build
Proven expertise in:
High-speed interface design
Clocking circuits (PLL/DLL/CDR)
Power management circuits
Strong experience in:
Analog IP integration at subsystem or SoC level
SPICE simulation, extraction, and modeling
Silicon bring-up and lab validation
Deep understanding of:
Advanced CMOS processes
Noise, jitter, SI/PI, and cross-domain coupling effects
Preferred Qualifications:
Deep knowledge of DRAM sub‑system architecture, specification, operation, or build.
Understanding of Physical Layout & Circuit Floor Planning
Excellent Problem‑Solving & Analytical Skills
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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