PC
Senior Substrate Layout Design engineer
Accepting applicationsPiper Companies · San Jose, CA
Full-Time Senior ASICCadenceFPGAaiate
Posted
25 Apr
Category
Test
Experience
Senior
Country
United States
Piper Companies is seeking a Senior Substrate Layout Designer who will be responsible for leading the design of advanced multi-die substrate packages. The layout designer will be onsite 5 days a week in Saratoga, CA or remote working Pacific coast time hours.
Responsibilities for the Substrate Layout Designer include:
Lead the end-to-end physical layout of high-density, multi-die substrate design.
Design and optimize bump maps, breakout routing, via structures, and layer stack-ups.
Collaborate with ASIC, signal integrity, and power teams to ensure clean escape routing and breakout strategies
Evaluate routing feasibility in co-design environments, considering die floorplans and mechanical constraints.
Drive DRC, DFM, and manufacturing rule checks to ensure fabrication readiness
Interface with substrate vendors and OSATs for tape-out and manufacturability validation.
Conduct technical reviews and iterate on layout improvements with internal and external stakeholders
Requirements for the Substrate Layout Designer include:
6 - 8+ years of experience in substrate layout design for high-performance IC packaging
Proven experience expertise in organic substrate design from silicon to BGA
Deep understanding of chiplet-based, multi-die, and advanced packaging (FPGA, CPU, CPU, MCM, CoWoS)
Strong collaboration skills with ASIC, signal, and power teams
Proficiency in Cadence Allegro APD and AutoCAD
Experience working with OSATs and substrate supplies
Bachelor’s degree in Electrical Engineering or equivalent experience.
Compensation for the Substrate Layout Designer includes:
Salary range: $150,000 - $180,000
Comprehensive benefits: Medical, Dental, Vision, 401k, PTO, holidays, and sick leave as required by law.
Keywords: Substrate layout, substrate, package substrate design, multi-die packaging, chiplet integration, CoWoS, MCM, BGA, FPGA, CPU, GPU, High-density interconnect, escape routing, signal integrity, power integrity, organic substrate, substrate tape-out, substrate DRC, cadence allegro APD, autocad, cadence SiP layout, EDA tools, Layout verification tools, ASIC, OSAT, mechanical co-design, floorplanning, design reviews
This job is open for applications on 4/24/2026. Applications for this job will be accepted for at least 30 days from the posting date.
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Responsibilities for the Substrate Layout Designer include:
Lead the end-to-end physical layout of high-density, multi-die substrate design.
Design and optimize bump maps, breakout routing, via structures, and layer stack-ups.
Collaborate with ASIC, signal integrity, and power teams to ensure clean escape routing and breakout strategies
Evaluate routing feasibility in co-design environments, considering die floorplans and mechanical constraints.
Drive DRC, DFM, and manufacturing rule checks to ensure fabrication readiness
Interface with substrate vendors and OSATs for tape-out and manufacturability validation.
Conduct technical reviews and iterate on layout improvements with internal and external stakeholders
Requirements for the Substrate Layout Designer include:
6 - 8+ years of experience in substrate layout design for high-performance IC packaging
Proven experience expertise in organic substrate design from silicon to BGA
Deep understanding of chiplet-based, multi-die, and advanced packaging (FPGA, CPU, CPU, MCM, CoWoS)
Strong collaboration skills with ASIC, signal, and power teams
Proficiency in Cadence Allegro APD and AutoCAD
Experience working with OSATs and substrate supplies
Bachelor’s degree in Electrical Engineering or equivalent experience.
Compensation for the Substrate Layout Designer includes:
Salary range: $150,000 - $180,000
Comprehensive benefits: Medical, Dental, Vision, 401k, PTO, holidays, and sick leave as required by law.
Keywords: Substrate layout, substrate, package substrate design, multi-die packaging, chiplet integration, CoWoS, MCM, BGA, FPGA, CPU, GPU, High-density interconnect, escape routing, signal integrity, power integrity, organic substrate, substrate tape-out, substrate DRC, cadence allegro APD, autocad, cadence SiP layout, EDA tools, Layout verification tools, ASIC, OSAT, mechanical co-design, floorplanning, design reviews
This job is open for applications on 4/24/2026. Applications for this job will be accepted for at least 30 days from the posting date.
Show more Show less
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