AO
III-V Photonic Chip Design and Fabrication Engineering Lead
Accepting applicationsAlpine Optoelectronics Inc. · San Francisco Bay Area
Full-Time Lead AIRFaiaterf
Posted
22 Apr
Category
Test
Experience
Lead
Country
United States
Alpine Optoelectronics, a subsidiary company of Eoptolink Technology, is seeking candidates with strong expertise in III-V photonic chip development. The candidate will be responsible for developing advanced photonic chips to support next-generation communications in data center networks and AI clusters. The responsibility will include III-V EPI and device designs for fabricating at external foundry, working with foundry to optimize the fabrication process, and test data analysis. The candidate is expected to innovate in III-V high-speed design and fabrications and bring it from design to production.
This position is at principal or above level. The candidate must have deep understanding of III-V photonic material, devices, and the associated fabrication process, must be able to optimize the fabrication process to improve the device performance and yield. In addition, the candidate must have successful experience of leading at least one of the following developments:
1) High power (>=100mW) DFB lasers in O-band or C-band.
2) High-speed (>=100Gb/s) EML.
3) High-speed (>=100Gb/s) III-V EAM or MZM.
The scope of the work may involve some of the following activities:
Design III-V EPIs, including multiple quantum-well (MQW) layers and waveguiding layers, for various III-V devices.
Design III-V devices, including high-speed modulators, high-speed photodetectors, and DFB lasers.
Design various photonic integrated circuits (PICs) incorporating III-V devices for high-speed optical communications.
Perform various simulations, such as optical mode simulation, high-speed RF simulation, quantum well absorption and index modulation simulation, and laser cavity simulation.
Work with external foundries for III-V chip manufacturing and for fabrication process improvement.
Plan for electrical, high-speed RF, and optical testing, and analyze test data.
Interact with packaging and module teams for chip performance evaluations in the modules.
Qualifications and Skills:
Master or higher degree in Electrical Engineering, Semiconductor Physics, Optical Communications, or other related fields.
Direct experience in III-V material, quantum well designs, device designs, device fabrication, and device testing, is highly preferred.
Skilled in optical simulation, high-speed RF modeling, laser cavity modeling and characterization. Familiar with the related software.
Some knowledge of Si photonic devices and circuits, pluggable and co-packaged optical transceivers, is desirable.
Some experience in III-V device failure and material defects analysis is desirable.
Excellent analytical and problem-solving abilities.
Strong communication skills and a proven ability to work both independently and as part of a team.
Work Location: Fremont, California
Please submit your resume to: info@alpineoptoelectronics.com
Show more Show less
This position is at principal or above level. The candidate must have deep understanding of III-V photonic material, devices, and the associated fabrication process, must be able to optimize the fabrication process to improve the device performance and yield. In addition, the candidate must have successful experience of leading at least one of the following developments:
1) High power (>=100mW) DFB lasers in O-band or C-band.
2) High-speed (>=100Gb/s) EML.
3) High-speed (>=100Gb/s) III-V EAM or MZM.
The scope of the work may involve some of the following activities:
Design III-V EPIs, including multiple quantum-well (MQW) layers and waveguiding layers, for various III-V devices.
Design III-V devices, including high-speed modulators, high-speed photodetectors, and DFB lasers.
Design various photonic integrated circuits (PICs) incorporating III-V devices for high-speed optical communications.
Perform various simulations, such as optical mode simulation, high-speed RF simulation, quantum well absorption and index modulation simulation, and laser cavity simulation.
Work with external foundries for III-V chip manufacturing and for fabrication process improvement.
Plan for electrical, high-speed RF, and optical testing, and analyze test data.
Interact with packaging and module teams for chip performance evaluations in the modules.
Qualifications and Skills:
Master or higher degree in Electrical Engineering, Semiconductor Physics, Optical Communications, or other related fields.
Direct experience in III-V material, quantum well designs, device designs, device fabrication, and device testing, is highly preferred.
Skilled in optical simulation, high-speed RF modeling, laser cavity modeling and characterization. Familiar with the related software.
Some knowledge of Si photonic devices and circuits, pluggable and co-packaged optical transceivers, is desirable.
Some experience in III-V device failure and material defects analysis is desirable.
Excellent analytical and problem-solving abilities.
Strong communication skills and a proven ability to work both independently and as part of a team.
Work Location: Fremont, California
Please submit your resume to: info@alpineoptoelectronics.com
Show more Show less
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