CO
IC Packaging Design Engineer
Accepting applicationsCORE Occupational Medicine · Hillsboro, OR
Full-Time Principal CadenceMentor
Posted
3d ago
Category
Eda
Experience
Principal
Country
United States
Role : IC Packaging Design Engineer
LOC: Chandler, AZ or Hillsboro, OR (ONSITE)
Experience : !0+ years
Skills Required : -
Bachelor s or Master s degree in Electrical /Electronics Engineering
Experience Tier: Senior-level (primary); Mid-level (secondary)
Senior-Level: ~10+ years in IC packaging / package design
Mid-Level: 4-6+ years (MS) or 6+ years (BS) in IC packaging / package design
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Experience :-
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Candidates Should Have Experience In The Below Domains
Physical Design & Layout
Substrate design and layout
SI/PI aware design implementation
Design for performance, manufacturability, yield, and reliability
Design rule compliance
Show more Show less
LOC: Chandler, AZ or Hillsboro, OR (ONSITE)
Experience : !0+ years
Skills Required : -
Bachelor s or Master s degree in Electrical /Electronics Engineering
Experience Tier: Senior-level (primary); Mid-level (secondary)
Senior-Level: ~10+ years in IC packaging / package design
Mid-Level: 4-6+ years (MS) or 6+ years (BS) in IC packaging / package design
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Experience :-
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Candidates Should Have Experience In The Below Domains
Physical Design & Layout
Substrate design and layout
SI/PI aware design implementation
Design for performance, manufacturability, yield, and reliability
Design rule compliance
Show more Show less