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High-Speed Package Design Engineer
Accepting applicationsNokia · New Providence, NJ
Full-Time Mid_senior PythonRFTclmixed-signal
Posted
12 Jun
Category
Eda
Experience
Mid_senior
Country
United States
Job Description
Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.
This role focuses on end-to-end package design ownership, including architecture definition, SI/PI analysis, electromagnetic modeling, and measurement correlation, while working closely with silicon, PCB, and system integration teams. The successful candidate will also contribute to package design enablement through ADKs and reusable libraries, in close collaboration with leading EDA vendors. Package and system design leadership is the primary emphasis of this role.
This position is suitable for senior-level engineers who are comfortable taking ownership of complex package designs while influencing broader design flows and infrastructure.
How You Will Contribute And What You Will Learn
Lead the design and development of high-speed IC packages, including SiP, FC-BGA, and advanced heterogeneous integration solutions
Define package architectures, stack-ups, routing strategies, and interconnect to meet SI/PI and RF requirements
Perform 3D EM simulation and SI/PI analysis of package transitions, passive components, and die-to-package interfaces
Co-optimize die, package, and PCB designs in collaboration with silicon, board, and system integration teams
Correlate simulation results with laboratory measurements (e.g., VNA, TDR/TDT, high-speed oscilloscope)
Contribute to the definition and evolution of package ADKs, reusable libraries, technology files, and verification flows, working in partnership with EDA vendors
Provide technical input and design validation for vendor-supported automation and enablement efforts
Support continuous improvement of package design methodologies and best practices across projects
Required Qualifications
KEY SKILLS AND EXPERIENCE
MS or PhD in Electrical Engineering, Applied Physics, or equivalent relevant industry experience
5+ years of hands-on experience in IC package design for high-speed, RF, or mixed-signal applications
Strong fundamentals in electromagnetics, signal integrity, and power integrity
Experience with 3D EM and package design tools (e.g., HFSS, CST, ADS, Allegro X APD, Xpedition, or equivalent)
Ability to work independently and collaboratively in a cross-functional, research-driven environment
Preferred Qualifications
Experience with advanced packaging technologies (chiplets, 2.5D/3D integration, interposers)
Familiarity with ADKs, PDKs, or design enablement concepts, including collaboration with EDA vendors
Working knowledge of Python and/or Tcl for design automation, simulation support, or data analysis
PCB design and technology (e.g., Altium or equivalent)
Show more Show less
Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.
This role focuses on end-to-end package design ownership, including architecture definition, SI/PI analysis, electromagnetic modeling, and measurement correlation, while working closely with silicon, PCB, and system integration teams. The successful candidate will also contribute to package design enablement through ADKs and reusable libraries, in close collaboration with leading EDA vendors. Package and system design leadership is the primary emphasis of this role.
This position is suitable for senior-level engineers who are comfortable taking ownership of complex package designs while influencing broader design flows and infrastructure.
How You Will Contribute And What You Will Learn
Lead the design and development of high-speed IC packages, including SiP, FC-BGA, and advanced heterogeneous integration solutions
Define package architectures, stack-ups, routing strategies, and interconnect to meet SI/PI and RF requirements
Perform 3D EM simulation and SI/PI analysis of package transitions, passive components, and die-to-package interfaces
Co-optimize die, package, and PCB designs in collaboration with silicon, board, and system integration teams
Correlate simulation results with laboratory measurements (e.g., VNA, TDR/TDT, high-speed oscilloscope)
Contribute to the definition and evolution of package ADKs, reusable libraries, technology files, and verification flows, working in partnership with EDA vendors
Provide technical input and design validation for vendor-supported automation and enablement efforts
Support continuous improvement of package design methodologies and best practices across projects
Required Qualifications
KEY SKILLS AND EXPERIENCE
MS or PhD in Electrical Engineering, Applied Physics, or equivalent relevant industry experience
5+ years of hands-on experience in IC package design for high-speed, RF, or mixed-signal applications
Strong fundamentals in electromagnetics, signal integrity, and power integrity
Experience with 3D EM and package design tools (e.g., HFSS, CST, ADS, Allegro X APD, Xpedition, or equivalent)
Ability to work independently and collaboratively in a cross-functional, research-driven environment
Preferred Qualifications
Experience with advanced packaging technologies (chiplets, 2.5D/3D integration, interposers)
Familiarity with ADKs, PDKs, or design enablement concepts, including collaboration with EDA vendors
Working knowledge of Python and/or Tcl for design automation, simulation support, or data analysis
PCB design and technology (e.g., Altium or equivalent)
Show more Show less