ASIC II - AMZ25487.3

Description

Employer: Annapurna Labs (U.S.) Inc.

Position: ASIC II AMZ25487.3

Location: Austin, TX

Multiple Positions Available

Develop detailed CFD and compact RC models for SoC and Package

thermal analysis

Knowledge of hardware and software based thermal / power

management control algorithms

Optimize air and liquid cooled thermal solutions under PPA and

system design constraints

Simulate and prototype thermal control strategies
Validate thermal models through power/thermal measurements on

Hardware

Responsible for the design and optimization of hardware for largescale data center deployment including rack level integration, liquidcooling facility integration and serviceability
Identify, design, test and integrate new thermal-mechanical

technologies for large-scale server deployments to deliver a world

class customer experience.

Own thermal-mechanical design from the lowest levels of chip SOC

design to rack assembly and see those systems all the way through

to high volume manufacturing.

Domestic or international travel up to 25% to perform role

Responsibilities May Be Required

(40 hours / week, 8:00am-5:00pm, Salary Range $141586 - $184000)

Amazon.com is an Equal Opportunity – Affirmative Action Employer – Minority / Female / Disability / Veteran / Gender Identity / Sexual Orientation

Basic Qualifications

Master’s degree or foreign equivalent degree in Mechanical Engineering, Thermal Engineering, or a related discipline and 3 years of experience in the job offered or a related occupation in mechanical engineering, thermal engineering or related. In the alternative, employer will accept a Bachelor’s degree or foreign equivalent degree in Mechanical Engineering, Thermal Engineering, or a related discipline followed by 5 years of progressively responsible post-baccalaureate experience in the job offered or a related occupation in mechanical engineering, thermal engineering or related. Experience must include:

3 years of experience in Mechanical and Thermal design of both air and liquid cooled electronic Systems
3 years of experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems
3 years of experience with SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
3 years of experience with programming languages: Python, C++, and working in Linux environment .

Preferred Qualifications

All applicants must meet all the above listed requirements.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.


Company - Annapurna Labs (U.S.) Inc. - D63

Job ID: A10372691
Show more Show less