Wet Process Engineer – Semiconductor Wafer Fabrication

Wet Process Engineer Semiconductor Wafer Fabrication

Location: Ahmedabad, Gujarat, India
Work Mode: Onsite
Experience: 6 -15 Years

Role Overview

We are seeking an experienced Wet Process Engineer to develop, optimize, qualify, and sustain wet chemical processing operations within an advanced semiconductor wafer fabrication facility. This role is responsible for establishing robust wafer cleaning, chemical treatment, surface preparation, oxide removal, and contamination control processes that enable high-yield semiconductor manufacturing and world-class device reliability.
The successful candidate will work closely with Lithography, Etch, CMP, Thin Film, Diffusion, Ion Implant, Process Integration, Equipment Engineering, Yield Engineering, Manufacturing, Metrology, Facilities, and Quality teams to optimize wet processes, reduce defects, improve wafer cleanliness, and support technology transfer and production ramp-up.
Candidates should possess strong expertise in wet chemistry, wafer cleaning, chemical compatibility, contamination control, defect reduction, process optimization, and Statistical Process Control (SPC).
Role Objectives
Develop world-class wafer cleaning and wet chemical processes.
Minimize contamination and particle-related yield losses.
Improve wafer surface quality and process consistency.
Support technology transfer and production ramp.
Deliver repeatable, scalable, and stable wet processing operations.
Key Responsibilities
Develop, optimize, and sustain wet process manufacturing operations for semiconductor wafer fabrication.
Establish process windows for wafer cleaning, oxide removal, surface conditioning, chemical etching, and post-process cleaning.
Optimize RCA cleaning, HF cleaning, SC-1, SC-2, ozone cleaning, sulfuric peroxide cleaning, and solvent cleaning processes.
Develop pre-diffusion, pre-oxidation, pre-deposition, post-etch, post-CMP, and post-implant cleaning methodologies.
Optimize process chemistry, chemical concentration, bath temperature, rinse cycles, and drying parameters.
Reduce contamination from particles, metallic impurities, organics, native oxides, and residues.
Perform Design of Experiments (DOE) to improve process capability and wafer cleanliness.
Analyze particle monitoring data, defect inspection reports, surface characterization, and yield trends.
Collaborate with CMP, Etch, Thin Film, Lithography, and Process Integration teams to optimize upstream and downstream process compatibility.
Support qualification of new cleaning chemistries, process chemicals, and consumables.
Work with Equipment Engineering to improve wet bench performance, chemical delivery systems, and equipment reliability.
Support installation, qualification, and acceptance of wet processing equipment.
Utilize Statistical Process Control (SPC) methodologies to monitor process stability and capability.
Perform root cause analysis for contamination events, process excursions, and yield losses.
Develop engineering specifications, operating procedures, and process documentation.
Participate in technology transfer and New Product Introduction (NPI) activities.
Improve manufacturing yield, cycle time, throughput, and process efficiency.
Ensure compliance with semiconductor quality systems, chemical handling procedures, cleanroom protocols, and EHS regulations.
Drive Lean Manufacturing and continuous improvement initiatives.
Key Responsibilities During Fab Startup
Support installation and qualification of wet process equipment.
Develop baseline wafer cleaning recipes for manufacturing.
Establish contamination control methodologies and qualification procedures.
Define chemical process specifications and process control plans.
Qualify cleaning chemicals, DI water systems, filters, and consumables.
Support engineering builds, pilot production, and technology transfer.
Develop manufacturing SOPs and engineering documentation.
Train manufacturing personnel on wet process operations and chemical safety.
Improve process capability before production ramp.
Support high-volume manufacturing readiness.
Required Qualifications
Bachelor's or Master's degree in Chemical Engineering, Materials Science, Electronics Engineering, Electrical Engineering, Chemistry, Physics, Semiconductor Engineering, or related discipline.
6 15 years of semiconductor wafer fabrication experience.
Strong expertise in wet process engineering and semiconductor cleaning technologies.
Experience supporting advanced semiconductor manufacturing.
Proven expertise in process optimization, contamination control, and yield improvement.
Excellent analytical, troubleshooting, and communication skills.
Technical Skills Semiconductor Manufacturing
Semiconductor Wafer Fabrication
Front-End Manufacturing (FEOL)
CMOS Process Technology
High Volume Manufacturing (HVM)
Semiconductor Process Development
Technology Transfer
Process Qualification
New Product Introduction (NPI)
Wet Process Technologies
Wafer Cleaning
Wet Chemical Processing
Surface Preparation
Surface Conditioning
Native Oxide Removal
Chemical Etching
Post-Etch Cleaning
Post-CMP Cleaning
Post-Implant Cleaning
Particle Removal
Metallic Contamination Removal
Organic Contamination Removal
Residue Removal
Surface Passivation
Wafer Drying
Wet Chemistry
RCA Clean
SC-1 Clean
SC-2 Clean
Dilute HF (DHF)
Buffered Oxide Etch (BOE)
Hydrofluoric Acid (HF)
Sulfuric Peroxide Mixture (SPM)
Ammonium Hydroxide (NH OH)
Hydrochloric Acid (HCl)
Hydrogen Peroxide (H O )
Ozone Cleaning
Megasonic Cleaning
DI Water Processing
IPA Drying
Marangoni Drying
Wet Process Equipment
Experience With Leading Semiconductor Wet Process Equipment Such As
SCREEN Semiconductor Solutions
TEL Clean Track Systems
SEMES Wet Processing Systems
Modutek Wet Benches
AP&S Cleaning Systems
ACM Research Wet Cleaning Systems
MEI Wet Process Equipment
Process Engineering
Design of Experiments (DOE)
Statistical Process Control (SPC)
Process Capability (Cp/Cpk)
Root Cause Analysis
FMEA
Yield Improvement
Defect Reduction
Contamination Control
Process Characterization
Chemical Compatibility
Metrology
Particle Inspection
Surface Particle Measurement
Defect Inspection
Optical Inspection
Surface Profilometry
Contact Angle Measurement
TOC Monitoring
Resistivity Monitoring
Surface Cleanliness Verification
Chemical Concentration Monitoring
Data Analysis
JMP
Python
MATLAB
SQL
Microsoft Excel
Statistical Analysis
Data Visualization
Cross Functional Collaboration
The Wet Process Engineer Will Work Closely With
Process Integration Engineering
Lithography Engineering
Etch Engineering
CMP Engineering
Thin Film Engineering
Diffusion Engineering
Ion Implant Engineering
Equipment Engineering
Yield Engineering
Manufacturing Engineering
Metrology Engineering
Facilities Engineering (UPW & Chemical Systems)
Product Engineering
Failure Analysis
Quality Engineering
Automation Engineering
Preferred Industry Experience
Experience In Semiconductor Manufacturing For
Logic Devices
Memory Devices
Foundry Manufacturing
Analog & Mixed-Signal ICs
Power Semiconductor Devices
RF Technologies
Advanced CMOS Manufacturing
Candidates with experience in greenfield semiconductor fab startups, advanced technology nodes (28nm and below), or high-volume manufacturing environments are highly preferred.

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