PP
Substrate IC Design Engineer
Accepting applicationsProFound People · Arizona, United States
Full-Time Mid_senior
Posted
1d ago
Category
Packaging
Experience
Mid_senior
Country
United States
⚡Substrate IC Design Engineer
☀️Arizona, USA.
📄Permanent
IC Package Substrate Design for high-performance multi-layer interposers
My client is changing the landscape of semiconductor manufacturing! Their technology completely transcends traditional packaging methods.
This is a high-impact role where you’ll play a key part in developing cutting-edge precision manufacturing processes for next-generation micro-scale technologies
This role includes shaping next-generation packaging architectures, including high-performance chip-to-chip integration solutions. Empowering in-house design of advanced substrate IC packages.
Qualifications required
Multiple years of experience in substrate IC package design
Must have strong experience in advanced packaging architectures.
Experience with hybrid bonding highly regarded.
Advanced proficiency in Allegro Package Designer (constraint management, routing)
Extensive experience designing large-format substrate packages (>50mm) with complex, high-density layouts
Strong understanding of SI/PI principles and their application to package-level design
Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches
If this sounds like something you'd be interested in, please reach out! / Send an email to 📩 Lewis@profoundpeople.com.au
Show more Show less
☀️Arizona, USA.
📄Permanent
IC Package Substrate Design for high-performance multi-layer interposers
My client is changing the landscape of semiconductor manufacturing! Their technology completely transcends traditional packaging methods.
This is a high-impact role where you’ll play a key part in developing cutting-edge precision manufacturing processes for next-generation micro-scale technologies
This role includes shaping next-generation packaging architectures, including high-performance chip-to-chip integration solutions. Empowering in-house design of advanced substrate IC packages.
Qualifications required
Multiple years of experience in substrate IC package design
Must have strong experience in advanced packaging architectures.
Experience with hybrid bonding highly regarded.
Advanced proficiency in Allegro Package Designer (constraint management, routing)
Extensive experience designing large-format substrate packages (>50mm) with complex, high-density layouts
Strong understanding of SI/PI principles and their application to package-level design
Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches
If this sounds like something you'd be interested in, please reach out! / Send an email to 📩 Lewis@profoundpeople.com.au
Show more Show less