SR/Lead -Hardware Design Engineer

Role & responsibilities
Design Ownership: Lead the complete hardware design process, including architecture definition, circuit design, schematic capture, and PCB layout for high-speed digital and mixed-signal boards.
High-Speed Design: Perform schematic and board-level design for high-speed protocols such as PCIe Gen4/Gen5, DDR4/DDR5, USB 4.0, and MIPI.
Simulation & Analysis: Perform Signal Integrity (SI), Power Integrity (PI), and thermal analysis to ensure design reliability.
Lab Validation: Lead board bring-up, troubleshooting, and debugging using advanced lab equipment (oscilloscopes, spectrum analyzers, logic analyzers).
Cross-functional Collaboration: Work closely with Firmware, Software, FPGA, and QA teams to ensure successful system integration and EMI/EMC compliance.
Documentation: Prepare detailed design specifications, Bill of Materials (BOM), and validation reports.

Basic Qualifications:
Bachelors or Masters degree in Electrical/Electronics/Communication Engineering or related field from a reputed institute.
6 to 10 years of progressive experience in board-level design within the semiconductor industry.
Proficiency in high-density/high-speed design including FPGAs, SerDes, PCIe Gen4/Gen5, UFS 4.0, 10/100 GigE, C-PHY/D-PHY, and USB 3.2.
Experience interfacing high-speed memories such as DDR4/DDR5, RDIMM, and SODIMM modules.
Strong experience in system integration, schematic design, and PCB layout using industry-standard tools such as SPICE, Altium, or Cadence.
Hands-on experience in hardware validation, board bring-up, and troubleshooting using advanced laboratory equipment.
Experience in Signal Integrity (SI) and Power Integrity (PI) analysis, including high-speed analog simulations using tools such as HFSS, SIwave, ADS, and HyperLynx.
Hands-on experience with 33GHz and 50GHz oscilloscopes and GHz pattern generators for protocol capture, timing, and eye diagram analysis.
Strong collaboration skills to work with RTL, Software, and Quality teams for system-level debugging and integration.
Good verbal and written communication skills with the ability to prepare documentation as per organizational standards.

Soft Skills:
Strong leadership, mentoring, and project management capabilities.
Excellent written and verbal communication skills for technical documentation and presentations.
Additional Requirement
Immediate joiners or candidates who can join within 30 days are preferred.
Should be from a Product/semiconductor-based company.

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