Senior PCB Layout Designer (High-Speed Systems)

KEY JOB DETAILS:
Position Title: Senior PCB Layout Designer (High-Speed Systems)
Location: Gurgaon (5 days Work from Office)
Experience Required: 4+ Years
Education: B.Tech Mechanical
Industry: Research & Development and Manufacturing of cutting-edge electronics systems for Defense, Military, Aerospace.

About Samtel
Samtel Avionics Ltd. (SA) is a key Indian player in high-technology products for avionics and military applications, rugged displays, cockpit displays and equipment for military and commercial platforms. Samtel Avionics straddles the entire value chain from design, development, manufacture, testing, qualification, repair & maintenance to obsolescence management of avionics products and equipment. Its products and services include Multi-Function Displays, Smart Multi-Function Displays, displays for commercial aircraft, Head Up Displays, Helmet Mounted Sight Displays, Automated Test Equipment, Multifunction Indicators: 3ATI & 4ATI, Optronics, Rugged displays for Land, Naval and Airborne platforms, Built-to-print/Built-to-Specs manufacturing, MRO services, and Obsolescence Management.

Role Overview

We are seeking an experienced Senior PCB Layout Engineer to design and develop high-reliability PCBs for defense, aerospace, avionics, and mission-critical electronic systems. The candidate will be responsible for end-to-end PCB layout activities, from schematic review and component placement to routing, design validation, and manufacturing release.

The role involves designing complex multilayer, high-speed digital, analog, mixed-signal, RF, and power electronics boards, with expertise in signal integrity, power integrity, impedance-controlled routing, EMI/EMC compliance, thermal management, and reliability-focused PCB design practices.

The candidate will work closely with hardware, mechanical, manufacturing, and quality teams to ensure robust, manufacturable, and standards-compliant PCB designs meeting industry requirements.

Key Responsibilities

Perform end-to-end PCB layout design from schematic review to manufacturing release.
Design complex high-speed digital, analog, mixed-signal, RF, power, FPGA, processor, memory, and communication boards.
Develop multilayer PCB stack-ups, component placement, routing, grounding, power distribution, and thermal management strategies.
Implement controlled impedance, differential pair routing, length matching, SI/PI, EMI/EMC, and high-speed interface design (DDR, PCIe, USB, Ethernet, LVDS, CAN, SPI, I²C, RS-422/485, MIL-STD-1553B, ARINC 429/717, etc.).
Create and maintain PCB libraries, footprints, pad stacks, and 3D models.
Apply DFM, DFA, DFT, reliability, creepage, clearance, and IPC design standards.
Support HDI and rigid-flex PCB designs, including advanced via technologies and manufacturing requirements.
Conduct design reviews, DRC checks, manufacturing validation, and collaborate with hardware, mechanical, quality, and production teams.
Generate manufacturing outputs such as Gerber/ODB++, drill files, assembly/fabrication drawings, BOMs, stack-up details, and release documentation.
Coordinate with PCB fabrication and assembly vendors, support prototype bring-up, testing, qualification, and production issue resolution.
Troubleshoot PCB-related issues, manage engineering changes, maintain revision control, and mentor junior designers while ensuring project timelines and quality standards are met.

Required Skills & Experience:

4–8 years of PCB layout design experience in Aerospace, Defense, Avionics, Automotive, or other high-reliability industries.
Proficiency in PCB design tools such as Cadence Allegro, Altium Designer, Siemens Xpedition/PADS, or OrCAD.
Experience in designing complex multilayer PCBs (8+ layers) with strong knowledge of stack-up design, component placement, routing, grounding, and power distribution.
Hands-on experience with high-speed PCB design, including controlled impedance, differential pairs, length matching, DDR, FPGA, Processor, and BGA-based layouts.
Understanding of Signal Integrity (SI), Power Integrity (PI), EMI/EMC, and thermal management principles.
Knowledge of HDI technologies, microvias, blind/buried vias, via-in-pad, and advanced fabrication techniques.
Experience with DFM, DFA, DFT, and reliability-focused design practices.
Ability to interpret schematics, mechanical drawings, and manufacturing requirements.
Familiarity with IPC Class 2/Class 3 standards; exposure to MIL-STD-810, MIL-STD-461, and DO-160 is preferred.

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