Senior IC Packaging Design Engineer

Senior IC Packaging Design Engineer

Location, Work Mode & Experience

Location: Chandler, Arizona OR Hillsboro, Oregon (Onsite)
Employment: Long-Term Contract (12+ Months)
Experience: 6 10 Years

Role Overview
We are looking for an experienced IC Packaging Design Engineer to develop advanced semiconductor package solutions for high-performance products. The role requires strong expertise in package layout, substrate implementation, SI/PI-aware design, manufacturability, and collaboration with package architects and system engineers.
Key Responsibilities
Develop complex IC package layouts for advanced semiconductor products.
Design high-density substrates using Siemens Xpedition or Cadence APD.
Perform package floorplanning and routing.
Work closely with SI/PI engineers during package implementation.
Optimize package performance for signal integrity and power delivery.
Ensure compliance with manufacturing and reliability requirements.
Support package architecture implementation.
Review package design quality and design rule compliance.
Resolve package layout issues.
Support engineering change implementation.
Mentor junior package designers.
Participate in design reviews with global engineering teams.
Required Qualifications
Bachelor's or Master's degree in Electrical/Electronics Engineering.
6 10 years of IC Packaging Design experience.
Strong experience with substrate layout and package implementation.
Experience designing advanced semiconductor packages.
Technical Skills EDA Tools
Siemens Xpedition (XPD)
Cadence APD
Cadence Allegro
Cadence SiP
Advanced Packaging
Advanced Package Design
High Density Substrate Design
Flip Chip Packaging
Multi-layer Package Design
Package Floorplanning
Physical Design
Physical Package Layout
Design Rule Compliance
Manufacturing Constraints
Yield Optimization
Electrical Performance
Signal Integrity (SI)
Power Integrity (PI)
Reliability
Design for Manufacturability (DFM)

#LI-SD1
Show more Show less