C

Senior Engineer - STA

Accepting applications

Cyient · Greater Hyderabad Area

Full-Time Senior ASICATPGBISTBoundary ScanCadence
Estimated market salary
₹59-105 LPA

This is a SiliconBoard market estimate, not an employer-posted salary.

Posted
3d ago
Category
Test
Experience
Senior
Country
India
Key Responsibilities
Static Timing Analysis & Signoff
Perform block-level and full-chip timing analysis and signoff.
Drive timing closure across all functional and test modes.
Analyze and fix setup, hold, recovery, removal, transition, capacitance, and pulse-width violations.
Perform timing signoff across multiple process, voltage, and temperature corners.
Execute MCMM (Multi-Corner Multi-Mode) timing analysis and closure.
Validate timing across hierarchical and flat SoC designs.
Timing Closure
Drive setup and hold optimization throughout implementation cycles.
Work closely with Physical Design teams to achieve timing convergence.
Perform timing ECO generation and validation.
Analyze critical timing paths and propose optimization strategies.
Resolve timing bottlenecks while maintaining area and power targets.
Support late-stage tapeout closure activities.
Cadence Signoff Flow
Strong hands-on experience in:
Cadence Tempus Timing Signoff
Cadence Innovus Timing Analysis
Cadence Voltus Integration
Cadence Quantus Extraction
Cadence Conformal ECO
Cadence Genus Synthesis (preferred)
Signal Integrity & Noise Analysis
Perform Crosstalk Analysis.
Analyze and resolve SI-related timing issues.
Validate noise, glitches, and signal integrity effects.
Work closely with physical design teams on route optimization and shielding techniques.
Ensure timing robustness under SI effects.
Low Power Verification
Verify clock gating implementations.
Analyze UPF/CPF constraints.
Validate low-power modes and timing requirements.
Support power-aware timing signoff methodology.
ECO Implementation & Verification
Generate timing ECOs for setup and hold closure.
Work with implementation teams to validate ECO impact.
Perform incremental timing signoff after ECO implementation.
Ensure clean final signoff before tapeout.
Cross-Functional Collaboration
Collaborate with:
RTL Design Teams
Physical Design Teams
DFT Engineers
Verification Teams
Architecture Teams
Foundry Support Teams
Participate in design reviews and closure meetings.
Support project execution from RTL freeze to tapeout.
Mandatory Technical Skills
Cadence Tool Expertise
Strong hands-on experience in:
Timing & Signoff
Cadence Tempus
Cadence Innovus
Cadence Quantus
Cadence Voltus
ECO & Verification
Cadence Conformal ECO
Conformal LEC
Synthesis (Preferred)
Cadence Genus
STA Expertise
Strong knowledge of:
✅ Static Timing Analysis (STA)
✅ MCMM Timing Closure
✅ Full Chip Timing Signoff
✅ Block Level Timing Signoff
✅ Timing ECO Closure
✅ Constraint Development (SDC)
✅ Path-Based Analysis
✅ Graph-Based Analysis
✅ Clock Tree Analysis
✅ Timing Exception Validation
✅ Setup/Hold Closure
✅ Recovery & Removal Checks
✅ Clock Domain Analysis
✅ CDC Timing Understanding
Timing Constraints Knowledge
Strong expertise in:
SDC Creation and Validation
Generated Clocks
Virtual Clocks
False Paths
Multi-Cycle Paths
Asynchronous Path Constraints
Timing Derates
OCV/AOCV/POCV
Useful Skew Methodology
Signal Integrity & Variability Analysis
Experience in:
Crosstalk Analysis
Noise Analysis
OCV Closure
AOCV
POCV
LVF-Based Flows
Variation-Aware Timing Signoff
Technology Node Experience
Mandatory experience in one or more:
28nm
16nm FinFET
12nm FinFET
7nm FinFET
5nm FinFET
Preferred:
3nm Technology Node
Advanced FinFET Implementation
Multi-billion Gate SoCs
4. DFT: Synopsys Tool:
Key Responsibilities
DFT Architecture & Planning
Define DFT strategy for complex ASIC/SoC designs.
Develop and review DFT specifications and test architecture.
Drive DFT implementation from RTL to Tapeout.
Collaborate with RTL, Physical Design, Verification, and Validation teams.
Ensure compliance with product quality and test coverage requirements.
Scan Insertion & Scan Compression
Implement and validate scan architecture.
Perform scan chain insertion and optimization.
Develop scan stitching methodologies.
Implement scan compression techniques to reduce tester memory and test time.
Debug scan connectivity and chain-related issues.
Responsibilities Include:
Scan Architecture Definition
Scan Stitching
Scan Chain Reordering
Scan Compression
EDT Implementation
Test Logic Verification
ATPG & Pattern Generation
Generate stuck-at, transition, path-delay, bridge, and cell-aware fault patterns.
Achieve targeted fault coverage goals for production devices.
Debug ATPG violations and improve testability.
Optimize pattern count and test execution time.
ATPG Activities
Stuck-at Fault ATPG
Transition Fault ATPG
Cell-Aware ATPG
Path Delay ATPG
Bridging Fault Coverage
Fault Simulation
Pattern Validation
MBIST/LBIST Implementation
Implement memory BIST architecture for embedded memories.
Support Memory Repair and Redundancy Analysis.
Integrate and verify LBIST implementation.
Collaborate with memory compiler and architecture teams.
Expertise Required
MBIST Planning
MBIST Integration
March Algorithms
Memory Repair Flow
BISR/BIRA Concepts
LBIST Flow
JTAG & Boundary Scan
Implement IEEE 1149.1 compliant JTAG architecture.
Integrate TAP Controller and Boundary Scan logic.
Debug JTAG connectivity and verification issues.
Support board-level test requirements.
Required Knowledge
JTAG
Boundary Scan
TAP Controller
IEEE 1149.1
IEEE 1500
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