RC
Senior Customer Package Design Integration Engineer (2.5D / 3D Packaging)
Accepting applicationsRapidus Corporation US · Albany, NY
Full-Time Mid_senior AICadencePCIeSerDesSynopsys
Posted
1d ago
Category
Test
Experience
Mid_senior
Country
United States
Position Overview
We are seeking a highly capable Customer Package Design Integration Engineer (2.5D / 3D Packaging) to ensure the successful execution of customer chiplet-based product development using Rapidus advanced packaging technologies.
This role serves as the primary technical and program interface between Rapidus and customers, integrating ADKs (Assembly Design Kits), packaging technologies, and customer design activities into a unified, successful outcome.
You will combine deep expertise in 2.5D/3D packaging and chiplet integration with strong program management and cross-functional coordination skills to drive customer designs from bring-up through tape-out in a rapidly evolving technology environment.
About Rapidus
Rapidus Corporation, founded in 2022, is Japan-led initiative to build a world-class advanced logic semiconductor foundry. With a bold vision to accelerate innovation, we are pioneering cutting-edge logic semiconductor research, development, design, and manufacturing to transform the global semiconductor industry.
Key Responsibilities
Customer Design Integration & Enablement
Lead customer design bring-up using Rapidus Assembly Design Kits (ADKs)
Guide customers in effectively applying:
Package design rules, libraries, and interface definitions
Interposer and substrate architectures
SI/PI/thermal design methodologies
Provide technical guidance on chiplet integration, including HBM, UCIe, PCIe, and high-speed SerDes
Program Execution & Delivery Ownership
Drive customer projects toward successful 2.5D/3D package design tape-out and product realization:
Manage:
Design schedules and milestones
Risks, issues, and dependencies
Cross-functional action items
Lead regular technical and program reviews with customers and internal teams
Cross-functional Integration (Core Responsibility)
Act as the central coordination point across:
Customer engineering teams
Package Design Engineering
ADK / Enablement teams
Process, manufacturing, and OSAT partners
Translate Rapidus technology updates into clear, actionable guidance for customers
Ensure alignment between design assumptions and manufacturing capabilities
Technical Issue Resolution
Support debugging and issue resolution in areas such as:
SI/PI and signal integrity challenges
Package layout and routing issues
ADK usage and interpretation
Drive root-cause analysis and coordinate solution deployment across teams
Continuous Improvement & Ecosystem Feedback
Capture customer feedback and drive improvements in:
ADK quality and usability
Design methodologies and flows
Documentation and training materials
Contribute to strengthening the chiplet ecosystem and customer readiness
Required Qualifications
B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or related field
5+ years of experience in semiconductor packaging, system design, or customer-facing engineering roles
Strong understanding of:
2.5D / 3D packaging (interposer, TSV, hybrid bonding, RDL/fan-out)
High-speed interfaces (HBM, PCIe, UCIe, SerDes)
Hands-on experience with package design and analysis tools (Cadence, Ansys, Synopsys, etc.)
Proven ability to manage complex technical programs and cross-functional activities
Strong communication skills with customer-facing experience
Preferred Qualifications
Experience in foundry, OSAT, or semiconductor customer support roles
Familiarity with ADK / PDK and design enablement flows
Experience with die-package-system co-design methodologies
Background in HPC, AI, or networking systems
Experience in silicon bring-up, validation, or failure analysis
Knowledge of advanced substrates (ABF, glass core, fan-out RDL)
Japanese language skills for collaboration with Japan-based customers
What You Will Impact
Ensure successful customer design execution and tape-out delivery
Bridge the gap between ADK (Assembly Design Kit: design environment) and real product realization
Integrate design, technology, and execution into a coherent development flow
Accelerate customer adoption of Rapidus advanced packaging technologies at 2nm and beyond
What We Offer
Opportunity to play a critical role in customer success for next-generation chiplet platforms
Work at the intersection of technology, execution, and system integration
Collaboration with global teams across the US and Japan
Competitive compensation and career growth opportunities
Benefits
Comprehensive Health, Dental and Vision coverage, fully at company's expense (no deductibles)
401k with no employer match
Show more Show less
We are seeking a highly capable Customer Package Design Integration Engineer (2.5D / 3D Packaging) to ensure the successful execution of customer chiplet-based product development using Rapidus advanced packaging technologies.
This role serves as the primary technical and program interface between Rapidus and customers, integrating ADKs (Assembly Design Kits), packaging technologies, and customer design activities into a unified, successful outcome.
You will combine deep expertise in 2.5D/3D packaging and chiplet integration with strong program management and cross-functional coordination skills to drive customer designs from bring-up through tape-out in a rapidly evolving technology environment.
About Rapidus
Rapidus Corporation, founded in 2022, is Japan-led initiative to build a world-class advanced logic semiconductor foundry. With a bold vision to accelerate innovation, we are pioneering cutting-edge logic semiconductor research, development, design, and manufacturing to transform the global semiconductor industry.
Key Responsibilities
Customer Design Integration & Enablement
Lead customer design bring-up using Rapidus Assembly Design Kits (ADKs)
Guide customers in effectively applying:
Package design rules, libraries, and interface definitions
Interposer and substrate architectures
SI/PI/thermal design methodologies
Provide technical guidance on chiplet integration, including HBM, UCIe, PCIe, and high-speed SerDes
Program Execution & Delivery Ownership
Drive customer projects toward successful 2.5D/3D package design tape-out and product realization:
Manage:
Design schedules and milestones
Risks, issues, and dependencies
Cross-functional action items
Lead regular technical and program reviews with customers and internal teams
Cross-functional Integration (Core Responsibility)
Act as the central coordination point across:
Customer engineering teams
Package Design Engineering
ADK / Enablement teams
Process, manufacturing, and OSAT partners
Translate Rapidus technology updates into clear, actionable guidance for customers
Ensure alignment between design assumptions and manufacturing capabilities
Technical Issue Resolution
Support debugging and issue resolution in areas such as:
SI/PI and signal integrity challenges
Package layout and routing issues
ADK usage and interpretation
Drive root-cause analysis and coordinate solution deployment across teams
Continuous Improvement & Ecosystem Feedback
Capture customer feedback and drive improvements in:
ADK quality and usability
Design methodologies and flows
Documentation and training materials
Contribute to strengthening the chiplet ecosystem and customer readiness
Required Qualifications
B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or related field
5+ years of experience in semiconductor packaging, system design, or customer-facing engineering roles
Strong understanding of:
2.5D / 3D packaging (interposer, TSV, hybrid bonding, RDL/fan-out)
High-speed interfaces (HBM, PCIe, UCIe, SerDes)
Hands-on experience with package design and analysis tools (Cadence, Ansys, Synopsys, etc.)
Proven ability to manage complex technical programs and cross-functional activities
Strong communication skills with customer-facing experience
Preferred Qualifications
Experience in foundry, OSAT, or semiconductor customer support roles
Familiarity with ADK / PDK and design enablement flows
Experience with die-package-system co-design methodologies
Background in HPC, AI, or networking systems
Experience in silicon bring-up, validation, or failure analysis
Knowledge of advanced substrates (ABF, glass core, fan-out RDL)
Japanese language skills for collaboration with Japan-based customers
What You Will Impact
Ensure successful customer design execution and tape-out delivery
Bridge the gap between ADK (Assembly Design Kit: design environment) and real product realization
Integrate design, technology, and execution into a coherent development flow
Accelerate customer adoption of Rapidus advanced packaging technologies at 2nm and beyond
What We Offer
Opportunity to play a critical role in customer success for next-generation chiplet platforms
Work at the intersection of technology, execution, and system integration
Collaboration with global teams across the US and Japan
Competitive compensation and career growth opportunities
Benefits
Comprehensive Health, Dental and Vision coverage, fully at company's expense (no deductibles)
401k with no employer match
Show more Show less