TL
RFIC Design with Strong Power Amplifier
Accepting applicationsTechnical Link LLC · San Diego, CA
Full-Time Principal GaNRFSOI
Posted
2d ago
Category
Design
Experience
Principal
Country
United States
RFIC Design with strong Power Amplifier exp.San DiegoHybrid Flex if manager likes themAny Visa Job Description: Key Responsibilities
IP Development: Identify and document novel circuit architectures and design
techniques to contribute to Finwave s growing Intellectual Property (IP) portfolio.
Technology Integration: Utilize Finwave s E-Mode GaN-on-Si processes to
achieve breakthroughs in power density and energy efficiency for 5G/6G and
SATCOM CPE. Advanced PA Design: Execute high-performance MMIC/Hybrid PA designs for
mobile RF front ends, optimized for Envelope Tracking (ET) and Average Power
Tracking (APT) operation.
End-to-End Development: Contribute to the full design lifecycle, including
architecture support, tape-out, prototype characterization, and debugging for high-
volume production
Collaboration: Work cross-functionally to document designs and ensure thermal
management strategies are integrated into high-power density applications.Qualifications & Skills
Education: Master s or PhD in Electrical Engineering, RF/Microwave Engineering,
or Physics.
Experience: 20+ years of experience in RF semiconductor design, with a proven
track record of shipping high-volume PA products for the global smartphone market.
Strong teamwork, communication, organization, and documentation skills.
Industry Standards: In-depth understanding of RFFE requirements for Tier-1
smartphone OEMs and current 3GPP standards.
Innovation Mindset: Proven ability to develop creative solutions for complex RF
challenges, supporting the generation of internal design specs and patents.
Technical Expertise
Device Physics: Mastery of GaN (preferred), III/V (GaAs) or SOI. compound
semiconductor device physics and advanced modeling.
Thermal Design: Deep understanding of thermal management strategies for high-
power density applications in a flip-chip configuration.
EDA Tools: Expert proficiency in Keysight ADS and Ansys HFSS for MMIC and
laminate co-simulation.
Linearity Management: Expertise in managing the trade-offs between Noise
Figure, Gain, and Input Third-Order Intercept Point (IIP3) for high-performance
mobile RFFEs.
Hands-on experience with RF/microwave test equipment such as network
analyzer, probe station, source/load pull system, noise figure measurements, and/or
signal sources/analyzers that deal with modulated signals.
Familiarity with Noise Theory is a plus: Design Low Noise Amplifier (LNA),
including impedance matching and impact of parasitic losses on the Noise Figure
(NF).
Show more Show less
IP Development: Identify and document novel circuit architectures and design
techniques to contribute to Finwave s growing Intellectual Property (IP) portfolio.
Technology Integration: Utilize Finwave s E-Mode GaN-on-Si processes to
achieve breakthroughs in power density and energy efficiency for 5G/6G and
SATCOM CPE. Advanced PA Design: Execute high-performance MMIC/Hybrid PA designs for
mobile RF front ends, optimized for Envelope Tracking (ET) and Average Power
Tracking (APT) operation.
End-to-End Development: Contribute to the full design lifecycle, including
architecture support, tape-out, prototype characterization, and debugging for high-
volume production
Collaboration: Work cross-functionally to document designs and ensure thermal
management strategies are integrated into high-power density applications.Qualifications & Skills
Education: Master s or PhD in Electrical Engineering, RF/Microwave Engineering,
or Physics.
Experience: 20+ years of experience in RF semiconductor design, with a proven
track record of shipping high-volume PA products for the global smartphone market.
Strong teamwork, communication, organization, and documentation skills.
Industry Standards: In-depth understanding of RFFE requirements for Tier-1
smartphone OEMs and current 3GPP standards.
Innovation Mindset: Proven ability to develop creative solutions for complex RF
challenges, supporting the generation of internal design specs and patents.
Technical Expertise
Device Physics: Mastery of GaN (preferred), III/V (GaAs) or SOI. compound
semiconductor device physics and advanced modeling.
Thermal Design: Deep understanding of thermal management strategies for high-
power density applications in a flip-chip configuration.
EDA Tools: Expert proficiency in Keysight ADS and Ansys HFSS for MMIC and
laminate co-simulation.
Linearity Management: Expertise in managing the trade-offs between Noise
Figure, Gain, and Input Third-Order Intercept Point (IIP3) for high-performance
mobile RFFEs.
Hands-on experience with RF/microwave test equipment such as network
analyzer, probe station, source/load pull system, noise figure measurements, and/or
signal sources/analyzers that deal with modulated signals.
Familiarity with Noise Theory is a plus: Design Low Noise Amplifier (LNA),
including impedance matching and impact of parasitic losses on the Noise Figure
(NF).
Show more Show less