Quality and Reliability Manager – Memory Products

Quality and Reliability Manager Memory Products

Location: Ahmedabad, Gujarat, India
Work Mode: Onsite
Employment Type: Full-Time
Experience: 12 - 18 Years

Industry: Semiconductor / ATMP / OSAT / Memory Products

Role Overview

We are looking for a Quality and Reliability Manager to lead product-quality, package-reliability and qualification activities for memory products in a high-volume semiconductor assembly and test environment.
The role will own reliability strategy, qualification execution, product-health monitoring, failure analysis and corrective-action closure for DRAM, NAND and related memory products. The position requires strong semiconductor product-quality knowledge and experience working across packaging, assembly, test, product engineering, manufacturing and customer-quality functions.
Key Responsibilities
Lead quality and reliability engineering for semiconductor memory products and package technologies.
Develop product- and package-qualification strategies aligned with JEDEC and customer requirements.
Define reliability test plans, qualification matrices, sample sizes, acceptance criteria and release requirements.
Manage reliability testing, including HTOL, HAST/uHAST, temperature cycling, MSL and high-temperature storage.
Review qualification results and approve products, packages, materials and process changes for manufacturing release.
Monitor product-health, reliability, yield, defect and quality indicators during high-volume manufacturing.
Lead investigation of reliability failures, manufacturing excursions, customer returns and field-quality issues.
Coordinate electrical and physical failure analysis to identify package-, process-, material- and device-related causes.
Drive root-cause analysis, containment, corrective action and recurrence-prevention activities.
Partner with package, product, process, test and equipment engineers during NPI and production ramp-up.
Assess reliability risks associated with material, equipment, supplier, process and package changes.
Establish reliability-monitoring plans and early-warning mechanisms for abnormal product trends.
Support supplier qualification and improvement programs for substrates, leadframes, mold compounds and other materials.
Lead 8D, CAPA, FMEA and risk-assessment activities for product-quality and reliability issues.
Prepare qualification reports, reliability summaries, risk assessments and customer-facing technical documentation.
Support customer audits, quality reviews and technical discussions related to product and package reliability.
Build and develop the quality and reliability engineering team.
Ensure laboratory methods, equipment and records comply with internal and industry requirements.
Required Qualifications
Bachelor s or Master s degree in Electronics, Electrical, Materials, Physics, Mechanical, Microelectronics Engineering or a related discipline.
12 18 years of semiconductor quality, product reliability, package reliability or qualification experience.
At least 4 6 years of experience managing quality, reliability or failure-analysis engineers.
Strong experience with semiconductor assembly, packaging and test operations.
Knowledge of DRAM, NAND, NOR or other memory-product reliability is strongly preferred.
Demonstrated experience planning and executing product and package qualification programs.
Hands-on knowledge of accelerated reliability testing and failure mechanisms.
Experience investigating qualification failures, manufacturing excursions and customer complaints.
Strong understanding of statistical data analysis, quality systems and risk-management methodologies.
Ability to support global teams and manufacturing escalations in a 24 7 production environment.
Technical Skills Memory Product Quality
DRAM and NAND product quality
Non-volatile memory reliability
Memory-package qualification
Product-health monitoring
Yield and defect analysis
Product-change qualification
Customer-quality management
Manufacturing-quality controls
Field-return analysis
Product lifecycle quality
Reliability Testing
High-Temperature Operating Life
Highly Accelerated Stress Test
Unbiased HAST
Temperature Cycling
Thermal Shock
Moisture Sensitivity Level
Preconditioning
High-Temperature Storage Life
Low-Temperature Storage
Board-Level Reliability
Mechanical and environmental testing
Package Reliability
Die-attach integrity
Wire-bond reliability
Intermetallic formation
Delamination
Package cracking
Mold-compound and substrate interaction
Solder-joint reliability
Package warpage
Electromigration and corrosion
Thermal and mechanical stress
Multi-die and stacked-die package reliability
Failure Analysis
Electrical failure analysis
Optical microscopy
X-ray inspection
Scanning Acoustic Microscopy
Decapsulation
Cross-section analysis
SEM/EDS
Dye-and-pry analysis
Thermal analysis
Fault isolation
Failure-mechanism identification
Quality and Statistical Tools
8D problem-solving
Root-cause analysis
CAPA
FMEA
Fault Tree Analysis
Design of Experiments
Statistical Process Control
Process Capability Analysis
Measurement System Analysis
Weibull and reliability-data analysis
JMP, Minitab or equivalent software
Standards and Compliance
JEDEC reliability standards
ISO 9001
IATF 16949
AEC-Q100 awareness
VDA 6.3
Customer-specific quality requirements
Change-control and qualification requirements
Leadership Responsibilities
Build and lead a strong product-quality and reliability engineering organization.
Assign ownership across qualification, reliability monitoring, failure analysis and customer-quality activities.
Establish technical review, escalation and corrective-action mechanisms.
Develop engineers through mentoring, technical training and competency planning.
Coordinate resources during NPI, qualification, production ramp and critical quality incidents.
Establish quality and reliability dashboards for senior-management review.
Promote a culture of technical discipline, prevention and continuous improvement.
Key Performance Indicators
The Position Will Be Responsible For Improving
Qualification success rate
Product and package reliability
Customer complaint and return rate
Reliability failure rate
Corrective-action closure time
Repeat-issue prevention
Product yield and defect performance
NPI and manufacturing-release readiness
Supplier-material quality
Audit and quality-system compliance


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