Process Engineer - Plating

Responsibilitis

Have strong background knowledge in EOL process and equipment for mold, plating,laser mark, trim and form.
Can support and train problem solving methodologies:
7 QC tools,
Basic SPC include SPC training,
Yield analysis with analytics
Sampling plan
8D
DMAIC Overview
Process mapping
Implementing Poka Yoke/ Lean Manufacturing
Design of Experiment (DOE)
FMEA
Knowledgeable in SPC tools (Minitab or JMP) is an advantage
Develop and implement production processes and can ensure to meet high quality standards
Develop and maintain accurate documentation of process changes, updates, and compliance with quality standards

Essential Attributes

Can work closely and effectively with cross-functional team (Production, Quality, NPI) to develop and implement SOPs.

Qualification

Educational Background: A Bachelor’s degree in Electronics/ Electrical Engineering, Mechanical Engineering, or a related field is typically required.

Desired Exprience Level

With minimum 8 years’ experience in assembly engineering on semiconductors industry
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