CI

Printed Circuit Board Design Engineer

Accepting applications

Creospan Inc. · United States

Contract Mid_senior RF
Posted
15 Jun
Category
Design
Experience
Mid_senior
Country
United States
Creospan is a growing tech collective of makers, shakers, and problem solvers, offering solutions today that will propel businesses into a better tomorrow. “Tomorrow’s ideas, built today!” In addition to being able to work alongside equally brilliant and motivated developers, our consultants appreciate the opportunity to learn and apply new skills and methodologies to different clients and industries.

******NO C2C/3RD PARTY, LOOKING FOR W2 CANDIDATES ONLY, must be able to work in the US without sponsorship now or in the future***


As a PCB Layout Engineer on Product Team, you will be responsible for driving world-class, complex PCB layouts that incorporate cutting-edge component and stack-up technologies. A core focus of this role is implementing miniaturization solutions within AR product designs. You will collaborate closely with internal electrical and mechanical engineers, DFM, SiPi, and other layout and library teams, as well as external suppliers.

RESPONSIBILITIES
Project Management & Execution:
Manage multiple complex layout projects, providing timely status reports within Meta systems.
Lead designs from kick-off through tape-out, encompassing rigid, rigid-flex, and flex PCBs for both product and non-product/test projects.
Proactively schedule and drive project meetings (Kick-off, Placement, Constraint, and Design Reviews) to ensure design verification using Meta's Design Traveler document.
Create and modify engineering tool project templates, meta-data, configuration data, and rules.
Technical Expertise & Problem Solving:
Apply a solid understanding of electrical engineering principles, particularly for power distribution, high-speed circuits, and RF signals.
Identify project execution risks or slowdowns proactively and collaborate with managers and/or technical program managers to propose alternative PCB development workflow solutions.
Understand and propose practical fit and function solutions related to miniaturization concepts.
Cross-Functional Collaboration & Supplier Engagement:
Proactively partner with EE Leads, Mechanical Engineering, TPMs, and other cross-functional teams (XFNs) to resolve design issues.
Work with internal DFM engineers to confirm supplier requirements at project launch.
Engage with external suppliers and Supplier Quality/Process Engineering (SQE/PE) to resolve DFM issues and ensure high-yield builds.

MINIMUM QUALIFICATIONS
8+ years of experience in complex PCB Design.
5+ years of experience using Allegro PCB Design Tools (version 23.1 or newer).
Strong understanding of the mechanical aspects of electronics design.
Excellent communication skills.
Proficiency with Microsoft Office tools.

PREFERRED QUALIFICATIONS
BS in Electrical Engineering.
3+ years of experience implementing miniaturization solutions in dense form-factor designs (e.g., wearable products, mobile phone design).

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