Principal Thermal & Mechanical Engineer

Principal Thermal & Mechanical Engineer
LOCATION: GREATER BENGALURU AREA


Company Descripti
onWe are looking for exceptional talent and leadership to join Fast Growing Startup into Scalable Intelligence, the world’s first company developing Agentic Silicon for powering the future of A
I.Founded in 2023, We have deep customer engagements across America, Europe, and Asia, and demonstrated functional prototypes to prove our concept and visio

n

.Location: Bangalore, Karna

ta


ka
At Tsavorite Scalable Intelligence, we are pioneering the semiconductor industry’s first Omni Processing Unit (OPU)—a breakthrough composable architecture designed to power the next generation of real-time, multi-modal Age
nticAI.Founded in 2023 by a veteran team from Intel, Nvidia, Qualcomm, and Apple, we are on a mission to eliminate the cost, power, and complexity bottlenecks of legacy GPU systems. Our technology delivers a 10x performance gain at 10% of energy consumption, scaling seamlessly from edge devices to exascale data
centers.Why Engineers
Join Us:Architectural Innovation: Work on the MultiPlexus™ fabric, a revolutionary interconnect offering petabyte-scale bandwidth and ultra-low
latency.Full-Stack Impact: We are building everything from modular chiplets on Samsung’s SF4X platform to our Tsavorite AI Orchestration Stack (TAOS), which provides zero-switching-cost compatibility for CUDA-optimized wo
rkflows.Market Momentum: We emerged from stealth with over $100 million in pre-orders from Global 500 companies and sovereign cloud pr

ovid

ers.Key Links
to IncludeOfficial Website: tsavo
ritesi.comLinkedIn Page: Tsavorite Scalable Intelligence
| LinkedInRecent News: Tsavorite Emerges with $100M in Orders & 10x Performanc
e (Forbes)https://www.businesswire.com/news/home/20251110678526/en/Tsavorite-Scalable-In

telli

gence Principal Thermal & Mechanical Engineer (10+
Years Exp.)Position Type: Full
-Time Level: Core Focus: Advanced Thermal Simulation, Package-Board Warpage, BGA Reliability, and Cross-Functional Electro-Mechanical A
rchitecture.Posit
ion OverviewWe are seeking a highly experienced Principal Thermal & Mechanical Engineer to lead the architecture, design, and implementation of cutting-edge thermal and mechanical packaging solutions. In this role, you will bridge the gap between silicon-level heat generation and system-level structural mechanics, developing optimized solutions ranging from sub 1
00W to1KW+.The ideal candidate will possess deep technical expertise in both advanced cooling methodologies (air and liquid) and package-level structural mechanics. You will utilize simulation suites to mitigate thermo-mechanical constraints, package/board warpage, and BGA solder joint stress, ensuring robust multi-year product
reliability.Key Resp
onsibilitiesThermal & Mechanical Architecture: Lead the end-to-end concept, architectural definition, and validation of desktop, server, and rack-level electronic packaging handling high power densities (1
00W to1KW+).Package & Board-Level Mechanics: Analyze, predict, and mitigate substrate, package, and PCB warpage resulting from Coefficient of Thermal Expansion (CTE) mismatch during surface mount technology (SMT) reflow and operational ther
mal cycling.BGA Stress & Reliability Engineering: Conduct high-fidelity stress and fatigue life prediction for fine-pitch Ball Grid Array (BGA) solder joints. Optimize thermo-mechanical reliability, design robust bolster plates, and define advanced heatsink dynamic/static loading
mechanisms.Advanced Simulation & FEA/CFD Modeling: Perform high-fidelity computational fluid dynamics (CFD) and thermal analysis using FloTHERM/Icepak. Drive structural mechanics simulations (FEA) for transient thermal shock, vibration, and mechanical shock packaging
qualifiers.Cross-Functional Collaboration: Act as the primary engineering stakeholder collaborating with Silicon, Advanced Packaging, and System Architecture teams to co-optimize electrical, thermal, mechanical, and financ
ial vectors.Cooling Technology Deployment: Evaluate, architect, and deploy a comprehensive portfolio of thermal solutions, seamlessly transitioning from advanced air-cooled mechanisms (vapor chambers, high-performance fin geometries) to liquid-cooling solutions (direct-to-chip, immersi
on cooling).Vendor & Manufacturing Management: Partner directly with global heatsink component, substrate, and mechanical fabrication suppliers to custom-design, prototype, and mass-produce solutions that strictly satisfy quality and volume r
equirements.Compliance & Industry Standards: Ensure all structural and thermal mechanics comply with stringent environmental and reliability benchmarks spanning from edge nodes to hyperscale data center inf
rastructure.Required Qu
alificationsExperience: 10–15+ years of direct, hands-on experience in thermal and mechanical design, package mechanics, and structural analysis within the semiconductor, electronic packaging, or server/data center infrastruc
ture domain.Education: Bachelor’s, Master’s, or Ph.D. degree in Mechanical Engineering, Aerospace Engineering, Materials Science, or a strictly related quantitative engineering
discipline.Package-Level Domain Expertise: Robust background in structural mechanics, creep/fatigue modeling of solder alloys, viscoelastic behavior of polymers, and classical fractur
e mechanics.Warpage Control: Proven track record of evaluating and mitigating board-level deflection and package warpage per JEDEC standards, optimizing dynamic and static heatsink preload to prevent BGA
fracturing.Advanced Analysis & Cooling: Deep technical baseline in high-power thermal solutions (up to 2KW), liquid cooling building blocks (CDUs, quick-disconnects, fluid manifolds), and environmental dynamic qualifications (shock and vibrati
on testing).Standards & Compliance: Complete working familiarity with industrial standards governing microelectronic and data center reliability, including JEDEC (JEP150 / JESD22), IPC-A-610, NEBS, ASHRAE, and
MIL-STD-810.Communication Skills: Exceptional written and verbal communication metrics; a verified background of successfully influencing technical roadmap choices across highly matrixed, multi-disciplinary engineering
ecosystems.Tools

famili
arity:Thermal Simulation (CFD): FloTHERM, Ansys Icepak,
CadenceCelsiusMechanical & FEA Analysis: Ansys Mechanical , Abaqus,
CadenceCelsius3D CAD & Geometric Modeling: PTC Creo (Pro/Engineer), SolidWorks, Aut

odesk I


n
ventor
ContactUdaymuday
_bhaskar@yahoo.co
mwww.mulyatech.com"Mining the Kn

owledge C

ommunity"
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