UT
Principal SI/PI Design Engineer
Accepting applicationsUSA Tech Recruit · New Jersey, United States
Full-Time Mid_senior CadenceRFaiatemixed-signal
Posted
4d ago
Category
Manufacturing
Experience
Mid_senior
Country
United States
Our client is a global leader in communications, networking, and advanced semiconductor technologies, developing next-generation solutions that enable high-bandwidth connectivity, optical communications, and data-intensive computing applications. With a strong focus on innovation across silicon, photonics, packaging, and system design, the company is investing heavily in cutting-edge products that push the boundaries of performance, efficiency, and scalability.
They are looking for an experienced Principal Signal Integrity / Power Integrity Design Engineer to lead advanced package design and electrical integration efforts for next-generation high-speed semiconductor and photonic products. This is a highly visible technical leadership role focused on package architecture, signal integrity, power integrity, RF performance, and advanced packaging technologies supporting complex mixed-signal systems.
Key Responsibilities:
Lead package selection and architecture decisions for next-generation semiconductor products, including package structures, BGA configurations, and system-in-package (SiP) solutions.
Evaluate performance, manufacturability, feasibility, and cost tradeoffs across package technologies.
Own package and substrate design activities from concept through tape-out, including layout, optimization, verification, and sign-off.
Perform signal integrity (SI), power integrity (PI), and RF simulations to optimize package and substrate performance.
Analyze high-speed interfaces and power delivery networks, identifying and resolving electrical performance bottlenecks.
Partner closely with silicon design, photonics, RF, manufacturing, and supplier teams to optimize floorplans, bump maps, and package pin assignments.
Drive design-for-manufacturing reviews and collaborate with external packaging vendors and manufacturing partners on new product development and production support.
Provide technical leadership across multidisciplinary engineering teams to ensure successful product execution from concept through production.
Key Qualifications:
Bachelor's degree in Electrical Engineering, Physics, or a related technical discipline.
5+ years of hands-on experience in IC package design and development.
Strong expertise in signal integrity, power integrity, and high-speed electrical design principles.
Proven experience leading package development programs from concept through production.
Preferred Experience:
Experience designing package substrates for RF, high-speed digital, and mixed-signal products.
Knowledge of advanced packaging technologies including 2.5D integration, 3D packaging, and interposer-based architectures.
Experience with package design tools such as Cadence APD and/or Xpedition Package Designer (XPD).
Expertise with SI/PI and electromagnetic simulation tools including HFSS, SIWave, or equivalent platforms.
Familiarity with electrical design reviews, SI/PI analysis reviews, package qualification, and manufacturing processes.
Experience collaborating with external suppliers, packaging vendors, and contract manufacturers.
What Makes a Strong Candidate:
Strong engineering fundamentals and analytical problem-solving skills.
Ability to solve complex multidisciplinary challenges spanning silicon, packaging, RF, and manufacturing.
Proven technical ownership and ability to drive projects to successful completion.
Excellent cross-functional communication and collaboration skills.
Detail-oriented mindset with a focus on performance, quality, and reliability.
By applying to this role you understand that we may collect your personal data and store and process it on our systems. For more information please see our Privacy Notice https://eu-recruit.com/wp-content/uploads/2024/07/European-Tech-Recruit-Privacy-Notice-2024.pdf
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They are looking for an experienced Principal Signal Integrity / Power Integrity Design Engineer to lead advanced package design and electrical integration efforts for next-generation high-speed semiconductor and photonic products. This is a highly visible technical leadership role focused on package architecture, signal integrity, power integrity, RF performance, and advanced packaging technologies supporting complex mixed-signal systems.
Key Responsibilities:
Lead package selection and architecture decisions for next-generation semiconductor products, including package structures, BGA configurations, and system-in-package (SiP) solutions.
Evaluate performance, manufacturability, feasibility, and cost tradeoffs across package technologies.
Own package and substrate design activities from concept through tape-out, including layout, optimization, verification, and sign-off.
Perform signal integrity (SI), power integrity (PI), and RF simulations to optimize package and substrate performance.
Analyze high-speed interfaces and power delivery networks, identifying and resolving electrical performance bottlenecks.
Partner closely with silicon design, photonics, RF, manufacturing, and supplier teams to optimize floorplans, bump maps, and package pin assignments.
Drive design-for-manufacturing reviews and collaborate with external packaging vendors and manufacturing partners on new product development and production support.
Provide technical leadership across multidisciplinary engineering teams to ensure successful product execution from concept through production.
Key Qualifications:
Bachelor's degree in Electrical Engineering, Physics, or a related technical discipline.
5+ years of hands-on experience in IC package design and development.
Strong expertise in signal integrity, power integrity, and high-speed electrical design principles.
Proven experience leading package development programs from concept through production.
Preferred Experience:
Experience designing package substrates for RF, high-speed digital, and mixed-signal products.
Knowledge of advanced packaging technologies including 2.5D integration, 3D packaging, and interposer-based architectures.
Experience with package design tools such as Cadence APD and/or Xpedition Package Designer (XPD).
Expertise with SI/PI and electromagnetic simulation tools including HFSS, SIWave, or equivalent platforms.
Familiarity with electrical design reviews, SI/PI analysis reviews, package qualification, and manufacturing processes.
Experience collaborating with external suppliers, packaging vendors, and contract manufacturers.
What Makes a Strong Candidate:
Strong engineering fundamentals and analytical problem-solving skills.
Ability to solve complex multidisciplinary challenges spanning silicon, packaging, RF, and manufacturing.
Proven technical ownership and ability to drive projects to successful completion.
Excellent cross-functional communication and collaboration skills.
Detail-oriented mindset with a focus on performance, quality, and reliability.
By applying to this role you understand that we may collect your personal data and store and process it on our systems. For more information please see our Privacy Notice https://eu-recruit.com/wp-content/uploads/2024/07/European-Tech-Recruit-Privacy-Notice-2024.pdf
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