CF
Principal Application Engineer
Accepting applicationsCritical Fit Recruiting · Anaheim, CA
Full-Time Mid_senior
Posted
4d ago
Category
Manufacturing
Experience
Mid_senior
Country
United States
Principal Application Engineer - Anaheim, CA Area
RESPONSIBILITIES
:Serve as the technical lead for advanced semiconductor packaging materials
.Work directly with customers to optimize wafer or panel-level encapsulation and molding processes
.Troubleshoot complex material and process issues for both developmental and commercial products
.Ensure successful product adoption by delivering clear, measurable value to customers
.Solve technology-specific challenges across product lines through innovative application development and material characterization
.Collaborate closely with R&D, sales, and product teams to translate customer needs into technical solutions
.
BACKGROUND PROFIL
E:Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related fiel
d.10+ years of experience in semiconductor advanced packaging materials or processe
s.Strong expertise in wafer-level encapsulation and molding technologie
s.Solid understanding of current and emerging packaging trends, including 2.5D and 3D packagin
g.Proven ability to work independently and lead technical discussions with customer
s.Strong communication skills with a customer-focused, ownership-driven mindse
t.Effective project and time management skills, with a consistent focus on quality and deliver
y.Willingness to travel up to 10
%.
Show more Show less
RESPONSIBILITIES
:Serve as the technical lead for advanced semiconductor packaging materials
.Work directly with customers to optimize wafer or panel-level encapsulation and molding processes
.Troubleshoot complex material and process issues for both developmental and commercial products
.Ensure successful product adoption by delivering clear, measurable value to customers
.Solve technology-specific challenges across product lines through innovative application development and material characterization
.Collaborate closely with R&D, sales, and product teams to translate customer needs into technical solutions
.
BACKGROUND PROFIL
E:Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related fiel
d.10+ years of experience in semiconductor advanced packaging materials or processe
s.Strong expertise in wafer-level encapsulation and molding technologie
s.Solid understanding of current and emerging packaging trends, including 2.5D and 3D packagin
g.Proven ability to work independently and lead technical discussions with customer
s.Strong communication skills with a customer-focused, ownership-driven mindse
t.Effective project and time management skills, with a consistent focus on quality and deliver
y.Willingness to travel up to 10
%.
Show more Show less