MT
Physical Design Director ( Hyderabad )
Accepting applicationsMulya Technologies · Greater Bengaluru Area
Full-Time Principal AIASICCadenceCalibreDFT
Posted
20h ago
Category
Design
Experience
Principal
Country
India
Top30 Semiconductor Organization in the world
Hyderabad
Role Overview
We are seeking a Physical Design Director to lead and grow our Physical Design function in Hyderabad. This is a senior leadership role responsible for building and managing a high-performing PD team, driving physical implementation of complex, high-speed connectivity ASICs, and establishing best-in-class design methodology and flows.
The ideal candidate brings deep hands-on expertise in full-chip physical design at advanced nodes, a proven track record of successful tapeouts, and the leadership ability to scale a team and deliver results in a fast-paced, high-growth environment. This role will work closely with global PD, RTL, DV, DFT, and packaging teams to ensure first-pass silicon success.
Key Responsibilities
Leadership & Team Buiding
Build, lead, and mentor a high-performing Physical Design team in Hyderabad across PnR, STA, EMIR/Power Integrity, and CAD/methodology fun
ctionsDefine team structure, hiring roadmap, and career development paths for PD eng
ineersFoster a culture of technical excellence, ownership, and continuous impro
vementPartner with global PD leadership (US and Israel sites) to align on strategy, methodology, and execution priorities
Physical Design Execution
Own end-to-end physical implementation of complex SoCs/ASICs from floor planning through GDSII
signoffDrive floor planning, placement, clock tree synthesis (CTS), routing, timing closure, power analysis (IR drop/EM), and physical verification (D
RC/LVS)Lead timing closure across multiple corners and modes (MMMC), ensuring robust STA signoff at advanced nodes (5nm and
below)Oversee power integrity and reliability analysis (IR drop, EM) to meet design quality and manufacturability
targetsManage tapeout schedules,milestones, and cross-functional dependencies to deliver on time and within PPAtargetsMethodology & CAD
Establish and continuously improve PD flows, methodologies, checklists, and best practices for first-pass
successEvaluate and deploy EDA tools (Cadence Innovus, Synopsys Fusion Compiler, PrimeTime, Calibre, RedHawk/Voltus, StarRC, etc.)Drive automation and scripting (Tcl, Python, Perl) to improve turnaround time and design
qualityCollaborate with EDA vendors on tool evaluation, adoption, and methodology improvements
Cross-Functional Collaboration
Partner closely with RTL, DV, DFT, packaging, and architecture teams to enable seamless integration of complex subsystems (SerDes, high-speed PHYs, die-to-die interfaces, etc.)Provide physical design input during architecture and floorplan feasibility studies, die sizing, and IP evaluationRepresent the Hyderabad PD team in global design reviews, tapeout readiness reviews, and leadership forums
Basic Qualifications
Bachelor's or master’s degree in electrical engineering, Electronics, or Computer Science18+ years of experience in ASIC physical design, with at least 5 years in a leadership or management roleShould be hands on with a proven track record of multiple successful tapeouts at advanced nodes (7nm or below); experience at 5nm/3nm strongly
preferred
Deep hands-on expertise in full-chip physical design: floorplanning, PnR, CTS, STA, IR/EM analysis, and physical verification
Strong proficiency with industry-standard EDA tools: Cadence Innovus, Synopsys Fusion Compiler/IC Compiler, PrimeTime, Calibre, RedHawk/Voltus
Experience with high-speed interface IPs such as SerDes, PCIe, CXL, or die-to-die (D2D/UCIe) interconnects
Strong scripting skills in Tcl, Python, or Perl
Demonstrated ability to build and lead global, cross-functional engineering teams
Preferred Qualifications
Experience with chiplet architecture, UCIe interfaces, or die-to-die physicalintegration
Familiarity with low-power design techniques (UPF/CPF, multi-voltage domains)
Experience working with TSMC advanced nodes and TSMC tapeout processes
Background in networking, storage, or AI/ML
SoC designs
Strong cross-functional collaboration skills with RTL, DFT, packaging, and silicon opera
tions teams
Experience establishing a PD center of excellence or greenfeld PDteam
Skills
Innovus
Fusion Compiler ( FC )
ICC2 ( IC Compiler)
Primetime (PT)
Calibre
Redhawk
Voltus
Tempus
Genus
Serdes
PCIe
CXL
D2D
UCIe
UPF
CPF
SoC
Contact:Uday
Mulya Technologies
muday_bhaskar@yahoo.com
Show more Show less
Hyderabad
Role Overview
We are seeking a Physical Design Director to lead and grow our Physical Design function in Hyderabad. This is a senior leadership role responsible for building and managing a high-performing PD team, driving physical implementation of complex, high-speed connectivity ASICs, and establishing best-in-class design methodology and flows.
The ideal candidate brings deep hands-on expertise in full-chip physical design at advanced nodes, a proven track record of successful tapeouts, and the leadership ability to scale a team and deliver results in a fast-paced, high-growth environment. This role will work closely with global PD, RTL, DV, DFT, and packaging teams to ensure first-pass silicon success.
Key Responsibilities
Leadership & Team Buiding
Build, lead, and mentor a high-performing Physical Design team in Hyderabad across PnR, STA, EMIR/Power Integrity, and CAD/methodology fun
ctionsDefine team structure, hiring roadmap, and career development paths for PD eng
ineersFoster a culture of technical excellence, ownership, and continuous impro
vementPartner with global PD leadership (US and Israel sites) to align on strategy, methodology, and execution priorities
Physical Design Execution
Own end-to-end physical implementation of complex SoCs/ASICs from floor planning through GDSII
signoffDrive floor planning, placement, clock tree synthesis (CTS), routing, timing closure, power analysis (IR drop/EM), and physical verification (D
RC/LVS)Lead timing closure across multiple corners and modes (MMMC), ensuring robust STA signoff at advanced nodes (5nm and
below)Oversee power integrity and reliability analysis (IR drop, EM) to meet design quality and manufacturability
targetsManage tapeout schedules,milestones, and cross-functional dependencies to deliver on time and within PPAtargetsMethodology & CAD
Establish and continuously improve PD flows, methodologies, checklists, and best practices for first-pass
successEvaluate and deploy EDA tools (Cadence Innovus, Synopsys Fusion Compiler, PrimeTime, Calibre, RedHawk/Voltus, StarRC, etc.)Drive automation and scripting (Tcl, Python, Perl) to improve turnaround time and design
qualityCollaborate with EDA vendors on tool evaluation, adoption, and methodology improvements
Cross-Functional Collaboration
Partner closely with RTL, DV, DFT, packaging, and architecture teams to enable seamless integration of complex subsystems (SerDes, high-speed PHYs, die-to-die interfaces, etc.)Provide physical design input during architecture and floorplan feasibility studies, die sizing, and IP evaluationRepresent the Hyderabad PD team in global design reviews, tapeout readiness reviews, and leadership forums
Basic Qualifications
Bachelor's or master’s degree in electrical engineering, Electronics, or Computer Science18+ years of experience in ASIC physical design, with at least 5 years in a leadership or management roleShould be hands on with a proven track record of multiple successful tapeouts at advanced nodes (7nm or below); experience at 5nm/3nm strongly
preferred
Deep hands-on expertise in full-chip physical design: floorplanning, PnR, CTS, STA, IR/EM analysis, and physical verification
Strong proficiency with industry-standard EDA tools: Cadence Innovus, Synopsys Fusion Compiler/IC Compiler, PrimeTime, Calibre, RedHawk/Voltus
Experience with high-speed interface IPs such as SerDes, PCIe, CXL, or die-to-die (D2D/UCIe) interconnects
Strong scripting skills in Tcl, Python, or Perl
Demonstrated ability to build and lead global, cross-functional engineering teams
Preferred Qualifications
Experience with chiplet architecture, UCIe interfaces, or die-to-die physicalintegration
Familiarity with low-power design techniques (UPF/CPF, multi-voltage domains)
Experience working with TSMC advanced nodes and TSMC tapeout processes
Background in networking, storage, or AI/ML
SoC designs
Strong cross-functional collaboration skills with RTL, DFT, packaging, and silicon opera
tions teams
Experience establishing a PD center of excellence or greenfeld PDteam
Skills
Innovus
Fusion Compiler ( FC )
ICC2 ( IC Compiler)
Primetime (PT)
Calibre
Redhawk
Voltus
Tempus
Genus
Serdes
PCIe
CXL
D2D
UCIe
UPF
CPF
SoC
Contact:Uday
Mulya Technologies
muday_bhaskar@yahoo.com
Show more Show less
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