Package Equipment Engineering Manager / Lead – Semiconductor Manufacturing

Package Equipment Engineering Manager / Lead Semiconductor Manufacturing

Location: Ahmedabad, Gujarat, India
Work Mode: Onsite
Employment Type: Full-Time
Experience: 12- 18 Years

Industry: Semiconductor / ATMP / OSAT / IC Packaging

Role Overview

We are looking for a Package Equipment Engineering Manager/Lead to manage equipment engineering for high-volume semiconductor assembly and packaging operations. The role will own equipment installation, qualification, performance, availability, maintenance strategy and continuous improvement across assigned packaging process areas.
The position requires hands-on experience with semiconductor assembly equipment, strong equipment troubleshooting capability and demonstrated leadership of engineers, technicians and equipment-improvement programs.
Key Responsibilities
Lead the package equipment-engineering team supporting 24 7 semiconductor manufacturing operations.
Own equipment performance across die preparation, die attach, wire bonding, molding, marking and package singulation.
Manage equipment installation, setup, acceptance testing, qualification and production release.
Develop equipment specifications, user requirements and technical acceptance criteria.
Coordinate equipment hook-up, safety checks, calibration and process qualification activities.
Establish preventive, predictive and condition-based maintenance strategies.
Improve equipment availability, utilization, OEE, mean time between failures and mean time to repair.
Lead technical troubleshooting for chronic equipment failures, process excursions and production interruptions.
Use equipment data, alarms, logs and failure history to identify performance-improvement opportunities.
Develop maintenance procedures, spare-parts strategies, equipment checklists and escalation mechanisms.
Manage equipment vendors during installation, warranty support, upgrades and corrective actions.
Partner with process engineering to improve equipment capability, repeatability and process control.
Support new-product introduction, capacity expansion and production ramp-up requirements.
Drive equipment automation, sensor integration, data collection and predictive-maintenance initiatives.
Lead equipment modifications, retrofits, cost reduction and productivity-improvement projects.
Ensure compliance with EHS, equipment-safety, cleanroom and quality requirements.
Build technical capability through recruitment, training, mentoring and competency development.
Prepare performance dashboards and communicate equipment risks, recovery plans and capital requirements.
Required Qualifications
Bachelor s or Master s degree in Mechanical, Electrical, Electronics, Mechatronics, Instrumentation, Automation Engineering or a related discipline.
12 18 years of equipment-engineering experience in semiconductor assembly, packaging, ATMP, OSAT or IDM backend manufacturing.
At least 4 6 years of experience leading equipment engineers, technicians or major equipment programs.
Strong hands-on experience with multiple semiconductor packaging equipment platforms.
Demonstrated experience in equipment installation, qualification and high-volume manufacturing support.
Proven record of improving OEE, equipment availability, MTBF, MTTR and manufacturing capacity.
Experience managing equipment vendors, service contracts, spare parts and technical escalations.
Ability to support production and equipment escalations in a 24 7 manufacturing environment.
Technical Skills Semiconductor Packaging Equipment
Wafer mounters and backgrinders
Wafer saw and dicing systems
Die sorters and pick-and-place systems
Die bonders and die-attach equipment
Wire bonders
Flip-chip bonders
Underfill and dispensing systems
Transfer or compression molding equipment
Trim-and-form systems
Laser marking equipment
Package saw and singulation systems
Inspection and material-handling equipment
Equipment Engineering
Equipment installation and commissioning
Site Acceptance Test and Factory Acceptance Test
Equipment qualification and production release
Equipment capability analysis
Preventive and predictive maintenance
Condition monitoring
Calibration and metrology
Equipment modification and retrofit
Troubleshooting and fault isolation
Spare-parts and lifecycle management
Automation and Controls
PLC and industrial controls
Servo and motion-control systems
Sensors, pneumatics and robotics
Machine vision
Equipment software and alarm systems
SECS/GEM
Equipment data collection
Manufacturing Execution Systems integration
Automated material handling
Predictive-maintenance analytics
Reliability and Improvement Tools
Overall Equipment Effectiveness
Mean Time Between Failures
Mean Time to Repair
Failure Mode and Effects Analysis
Root-cause analysis
8D problem-solving
Fault Tree Analysis
Pareto analysis
Total Productive Maintenance
Statistical Process Control
Leadership Responsibilities
Build and lead a capable package equipment-engineering organization.
Establish equipment ownership across process modules and production lines.
Define escalation procedures and technical response requirements.
Develop engineers and technicians through structured training and mentoring.
Manage staffing, shift coverage and on-call support for continuous operations.
Coordinate equipment resources during installation, capacity ramp and critical failures.
Establish vendor-performance and equipment-maintenance review mechanisms.
Key Performance Indicators
The Position Will Be Responsible For Improving
Equipment availability
Overall Equipment Effectiveness
Mean Time Between Failures
Mean Time to Repair
Equipment utilization
Unplanned downtime
Preventive-maintenance compliance
Equipment-related yield loss
Units per hour
Maintenance cost
Spare-parts availability
Capacity and production readiness


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