NAND Product Development Engineer

Job Description
We are seeking a senior NAND Product/Test Development Engineer and technical leader to drive test strategy and innovation for next-generation NAND Flash memory products. This role is responsible for leading burn-in or high-speed I/O test development, guiding junior engineers, and driving cross-functional projects across Design, Process, Reliability, Manufacturing, and SSD teams. The successful candidate will influence product quality, reliability, test cost, and technology roadmap decisions while enabling industry-leading QLC and PLC NAND solutions for AI-driven datacenter storage applications.

Major Responsibilities
Lead the development and optimization of burn-in, reliability screening, and high-speed I/O test methodologies for NAND Flash products.
Drive electrical validation, test coverage improvement, yield enhancement, and test cost reduction initiatives across NAND products.
Lead root cause investigations of complex test and product failures through statistical analysis, electrical failure analysis, and cross-functional collaboration.
Provide technical leadership for new product introduction (NPI), test program development, qualification, and manufacturing ramp.
Lead cross-functional projects involving Design, Process, Reliability, Manufacturing, OSAT, and SSD engineering teams.
Mentor and guide junior engineers on test methodology development, failure analysis, data interpretation, and technical problem solving.
Define and drive backend test roadmap initiatives, including test time reduction, screening optimization, and next-generation test technology deployment.
Work closely with SSD engineering teams to enable NAND component and SSD system co-optimization for quality and reliability improvements.

Qualifications
Master's degree in Electrical/Electronic Engineering, Computer Engineering, Semiconductor Circuits, or related fields.
5+ years of experience in NAND, memory product engineering, test engineering, or reliability engineering.
Strong knowledge of statistical data analysis, electrical failure analysis, and semiconductor test methodologies.
Experience with NAND Flash architecture, burn-in screening, high-speed I/O testing, and manufacturing test optimization preferred.
Demonstrated technical leadership and ability to lead cross-functional projects and mentor engineers.
Strong communication, collaboration, and problem-solving skills.

Additional Information
This position is also eligible to participate in Solidigm's restricted stock unit (RSU), restricted cash unit (RCU), and cash bonus programs. In addition, Solidigm offers a benefits package that includes medical, dental, vision, supplemental life and AD&D insurance; short- and long-term disability; healthcare and dependent care flexible spending accounts, and a company match on eligible 401(k) plan contributions.
The compensation range for this role is $121,280 - $194,100. Actual compensation is influenced by a variety of factors including but not limited to skills, experience, qualifications, and geographic location.
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