LT
Lead Physical Design Engineer
Accepting applicationsLeadSoc Technologies Pvt Ltd · Bengaluru, Karnataka, India
Full-Time Mid_senior ASICCadenceDFTInnovusPerl
Estimated market salary
₹26-46 LPA
This is a SiliconBoard market estimate, not an employer-posted salary.
Posted
20h ago
Category
Design
Experience
Mid_senior
Country
India
Lead Physical Design Engineer
Location: Bengaluru, India
Experience: 8–12+ Years
Role Overview
We are seeking a highly skilled Lead Physical Design Engineer to drive planning, execution, and closure of multiple complex ASIC/SoC blocks. The ideal candidate will have strong hands-on expertise in block-level implementation and signoff across advanced technology nodes.
Responsibilities
Own end-to-end execution and closure of multiple highly complex blocks with challenging congestion and timing requirements.
Drive block-level floorplanning, placement, CTS, routing, ECO implementation, and QoR optimization using Cadence Innovus.
Lead timing closure activities including Setup/Hold optimization, MMMC analysis, constraints/exceptions management, and QoR improvement.
Debug congestion and routability issues through macro placement, pin access optimization, blockages, and density management.
Ensure signoff readiness including DRC/LVS closure, SI-aware optimization, and IR/EM convergence.
Define and track block-level metrics and drive closure actions to meet schedule and quality targets.
Collaborate closely with STA, DFT, Synthesis, and CAD teams to ensure smooth tapeout execution.
Requirements
8–12+ years of ASIC/SoC Physical Design experience with multiple successful tapeouts.
Strong hands-on expertise in Cadence Innovus for block-level implementation.
Experience with advanced nodes (2nm/3nm/4nm/6nm) and mature technologies.
Solid understanding of MMMC, SI, IR/EM, DRC/LVS signoff methodologies.
Proficiency in Tcl scripting (mandatory); Python, Perl, and Shell scripting are preferred.
Excellent debugging, cross-functional collaboration, and communication skills.
Show more Show less
Location: Bengaluru, India
Experience: 8–12+ Years
Role Overview
We are seeking a highly skilled Lead Physical Design Engineer to drive planning, execution, and closure of multiple complex ASIC/SoC blocks. The ideal candidate will have strong hands-on expertise in block-level implementation and signoff across advanced technology nodes.
Responsibilities
Own end-to-end execution and closure of multiple highly complex blocks with challenging congestion and timing requirements.
Drive block-level floorplanning, placement, CTS, routing, ECO implementation, and QoR optimization using Cadence Innovus.
Lead timing closure activities including Setup/Hold optimization, MMMC analysis, constraints/exceptions management, and QoR improvement.
Debug congestion and routability issues through macro placement, pin access optimization, blockages, and density management.
Ensure signoff readiness including DRC/LVS closure, SI-aware optimization, and IR/EM convergence.
Define and track block-level metrics and drive closure actions to meet schedule and quality targets.
Collaborate closely with STA, DFT, Synthesis, and CAD teams to ensure smooth tapeout execution.
Requirements
8–12+ years of ASIC/SoC Physical Design experience with multiple successful tapeouts.
Strong hands-on expertise in Cadence Innovus for block-level implementation.
Experience with advanced nodes (2nm/3nm/4nm/6nm) and mature technologies.
Solid understanding of MMMC, SI, IR/EM, DRC/LVS signoff methodologies.
Proficiency in Tcl scripting (mandatory); Python, Perl, and Shell scripting are preferred.
Excellent debugging, cross-functional collaboration, and communication skills.
Show more Show less
Similar Jobs
IG
Application Specific Integrated Circuit Design Engineer
Insight Global · St Paul, MN
TI
Application Specific Integrated Circuit Design Engineer
Trilyon, Inc. · San Jose, CA
HI
FPGA Firmware Engineer
Haigh-Farr, Inc. · Bedford, NH
AW
Physical Design Engineer - Static Timing Analysis, Annapurna Labs, Cloud Scale Machine Learning
Amazon Web Services (AWS) · Cupertino, CA