ET
IC Packaging Engineer
Accepting applicationsElement Technologies · Chandler, AZ
Contract Entry CadenceMentor
Posted
11 Jun
Category
Design
Experience
Entry
Country
United States
IC Packaging Design Engineer
LOC: Chandler, AZ or Hillsboro, OR (ONSITE)
Longterm Contract – 1 Year
Bachelor’s or Master’s degree in Electrical /Electronics Engineering
Experience:
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Candidates should have experience in the below domains:
Physical Design & Layout
Substrate design and layout
SI/PI aware design implementation
Design for performance, manufacturability, yield, and reliability
Design rule compliance
Show more Show less
LOC: Chandler, AZ or Hillsboro, OR (ONSITE)
Longterm Contract – 1 Year
Bachelor’s or Master’s degree in Electrical /Electronics Engineering
Experience:
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Candidates should have experience in the below domains:
Physical Design & Layout
Substrate design and layout
SI/PI aware design implementation
Design for performance, manufacturability, yield, and reliability
Design rule compliance
Show more Show less
Similar Jobs
M
MTS, Analog Design Engineering
Micron · Boise, United States, North America
M
Senior Engineer, STPG PE (FDV-Verilog)
Micron · Singapore, Singapore, Asia
M
Digital IC Design Engineer - Early Career
Marvell · Westborough, United States, North America
M
Staff Firmware/Software Engineer- Embedded SoC/Microcontroller/DSP/SERDES/AEC/Microled/ODSP/PHY/AI Connectivity
Marvell · Santa Clara, United States, North America