ET
IC Packaging Engineer
Accepting applicationsElement Technologies · Chandler, AZ
Contract Entry CadenceMentor
Posted
11 Jun
Category
Design
Experience
Entry
Country
United States
IC Packaging Design Engineer
LOC: Chandler, AZ or Hillsboro, OR (ONSITE)
Longterm Contract – 1 Year
Bachelor’s or Master’s degree in Electrical /Electronics Engineering
Experience:
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Candidates should have experience in the below domains:
Physical Design & Layout
Substrate design and layout
SI/PI aware design implementation
Design for performance, manufacturability, yield, and reliability
Design rule compliance
Show more Show less
LOC: Chandler, AZ or Hillsboro, OR (ONSITE)
Longterm Contract – 1 Year
Bachelor’s or Master’s degree in Electrical /Electronics Engineering
Experience:
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Candidates should have experience in the below domains:
Physical Design & Layout
Substrate design and layout
SI/PI aware design implementation
Design for performance, manufacturability, yield, and reliability
Design rule compliance
Show more Show less
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