BS
IC package substrate Design
Accepting applicationsBayOne Solutions · Bengaluru, Karnataka, India
Full-Time Mid_senior FCBGAFCCSPSiPFlip-ChipSubstrate Design
Posted
1d ago
Category
Packaging
Experience
Mid_senior
Country
India
About role:
Are you passionate about semiconductor packaging and advanced package substrate design? Join our team and work on cutting-edge technologies supporting next-generation high-performance computing, networking, AI, and consumer semiconductor products.
Key Responsibilities
Design and develop IC package substrates for advanced semiconductor packages (FCBGA, FCCSP, SiP, Flip-Chip)
Create substrate layouts including bump maps, ball maps, stack-ups, escape routing, and high-speed signal routing
Perform package routing while considering Signal Integrity (SI), Power Integrity (PI), and manufacturability
Collaborate with cross-functional teams including IC, PCB, SI/PI, mechanical, and manufacturing engineers
Generate fabrication outputs and ensure design compliance through DRC and design reviews
Required Skills
Experience in IC Package Substrate Design and package layouts
Hands-on expertise with Cadence Allegro Package Designer (APD) or APD+
Strong knowledge of FCBGA, FCCSP, Flip-Chip, Wire Bond, SiP, and substrate technologies
Good understanding of Signal Integrity (SI), Power Integrity (PI), PDN, and package manufacturing processes
Familiarity with interfaces such as DDR/LPDDR, PCIe, USB, Ethernet, SerDes, or HBM is preferred.
Preferred Qualifications
Bachelor's or Master's degree in Electronics, Electrical Engineering, VLSI, or a related fie
7+ years of experience in semiconductor package substrate design
Strong analytical, debugging, and communication skills
Show more Show less
Are you passionate about semiconductor packaging and advanced package substrate design? Join our team and work on cutting-edge technologies supporting next-generation high-performance computing, networking, AI, and consumer semiconductor products.
Key Responsibilities
Design and develop IC package substrates for advanced semiconductor packages (FCBGA, FCCSP, SiP, Flip-Chip)
Create substrate layouts including bump maps, ball maps, stack-ups, escape routing, and high-speed signal routing
Perform package routing while considering Signal Integrity (SI), Power Integrity (PI), and manufacturability
Collaborate with cross-functional teams including IC, PCB, SI/PI, mechanical, and manufacturing engineers
Generate fabrication outputs and ensure design compliance through DRC and design reviews
Required Skills
Experience in IC Package Substrate Design and package layouts
Hands-on expertise with Cadence Allegro Package Designer (APD) or APD+
Strong knowledge of FCBGA, FCCSP, Flip-Chip, Wire Bond, SiP, and substrate technologies
Good understanding of Signal Integrity (SI), Power Integrity (PI), PDN, and package manufacturing processes
Familiarity with interfaces such as DDR/LPDDR, PCIe, USB, Ethernet, SerDes, or HBM is preferred.
Preferred Qualifications
Bachelor's or Master's degree in Electronics, Electrical Engineering, VLSI, or a related fie
7+ years of experience in semiconductor package substrate design
Strong analytical, debugging, and communication skills
Show more Show less