DM
Hardware Engineer
Accepting applicationsDigital Media Professionals Inc. · Bengaluru, Karnataka, India
Full-Time Entry AICadenceDDRDFTEthernet
Estimated market salary
₹6-11 LPA
This is a SiliconBoard market estimate, not an employer-posted salary.
Posted
21h ago
Category
Manufacturing
Experience
Entry
Country
India
Role: Senior Hardware FAE
Company: Digital Media Professionals Inc. (DMP), Japan
Location: India — co-located with our India Technical Lead for close day-to-day collaboration ([City])
Reports to: India Technical Lead
Engagement Type: Independent contractor / consulting engagement (full-time commitment)
Experience Level: Senior (5–8+ years)
Compensation: Competitive — to be discussed based on experience
About the Role
DMP's edge-AI camera SoC business in India is growing rapidly, with Indian customers developing production camera boards based on our Di1 platform and its EVB reference design. Today, software support is provided locally by our India FAE team, while hardware questions are handled by our hardware design team in Japan — adding turnaround delays across time zones.
We are engaging a hands-on senior hardware engineer in India to become the first line of hardware technical support for our Indian customers. Your primary mission is reviewing customer-designed boards and supporting them through to production. Looking ahead, DMP may also develop Di1-based boards using Indian board design vendors, and you would be the technical lead for that engagement. You will propose custom board designs based on our reference platform and physically debug and rework boards in the lab and at customer sites. You will work under the direction of the India Technical Lead, in close coordination with DMP's hardware design team in Japan and our SoC partner in Taiwan. The role is focused on customers in India, with potential involvement in Japan-side projects in the future.
Key Responsibilities
• Customer schematic & layout review (primary): Review customer schematics and PCB layouts for Di1-based camera boards against the hardware application note and reference design; issue written review reports (findings, severity, required corrections) and follow through to the next revision. Act as first-line hardware reviewer in India, escalating only complex or high-risk items to the Japan hardware team with clear, reproducible problem descriptions.
• Vendor technical management: Manage the technical engagement with customers' board design and manufacturing vendors: design guidance, review cycles, DFM/DFT feedback, EVT/DVT build support, and issue tracking to closure. In the future, act as the technical lead when DMP develops Di1-based boards with Indian board design vendors.
• Board development proposals: Propose custom board architectures derived from the EVB/DevKit reference design: block diagrams, component selection (DRAM, SPI NAND storage, audio codec, Ethernet PHY, power tree), and BOM cost/availability trade-offs for the Indian market.
• Hands-on bring-up, debug & rework: Bring up prototype boards; debug power sequencing, boot, sensor/MIPI, DDR, and Ethernet issues using oscilloscope, logic analyzer, and JTAG. Perform board rework by hand — fine-pitch soldering, SMD replacement (hot-air/iron), and jumper-wire rework — at our lab and at customer sites.
• Technical support & documentation: Answer customer hardware queries (interface design, part alternatives, compliance) with concise written responses; build local FAQ and known-issues documentation; define bring-up procedures and debug strategies together with firmware/BSP teams.
• Cross-site collaboration: Work across time zones with counterparts in India, Japan, and Taiwan. Domestic travel within India to customer and vendor sites is required.
Required Qualifications
• B.E./B.Tech in Electronics/Electrical Engineering, or equivalent practical experience.
• 5–8+ years of board design or in-depth design review experience in camera, embedded, or consumer/industrial electronics, including at least one product taken from schematic to mass production.
• Linux / Yocto BSP literacy for boot- and driver-level debug.
• Schematic capture and PCB layout review capability (Altium preferred; OrCAD/Cadence acceptable).
• High-speed digital design: impedance control, length matching, PCB stack-up definition.
• DDR memory interface design (DDR3/LPDDR3/DDR4/LPDDR4).
• Image sensor and ISP interface design: MIPI CSI-2, I2C sensor control.
• Ethernet PHY integration (RGMII).
• Multi-rail power design: PMIC selection, DC/DC + LDO sequencing (EN / power-good).
• Proven hands-on experience with oscilloscope-based hardware bring-up and debug (mandatory); working experience with logic analyzer and JTAG.
• Proven hands-on soldering experience: fine-pitch soldering and SMD rework on production-class boards.
• EMI/EMC/ESD compliance design fundamentals.
• DFM/DFT and production readiness: EVT/DVT, prototype builds, root-cause analysis.
• Customer-facing communication: explains hardware issues clearly to customers and engineering teams.
• Clear written communication in English: concise review reports, issue reports, and vendor queries — critical when working with teams a time zone away.
Preferred Experience
• Edge AI SoC / NPU platform experience (Ambarella, HiSilicon, Rockchip, Qualcomm edge, or similar).
• Reference design adaptation: taking an EVB/DevKit to a custom production board.
• New platform evaluation: assessing image sensors, ISPs, and SoCs for future designs.
• Secure boot hardware: OTP, secure element / TPM provisioning.
• Cross-functional interface definition with firmware/BSP, mechanical, and manufacturing teams.
• Signal integrity measurement with TDR / network analyzer.
Nice to Have
• CCTV / IP camera product background (ONVIF, RTSP).
• ISP tuning awareness — enough sensor–ISP understanding to isolate image issues to hardware.
• Stereo / depth camera hardware (dual-camera sync, calibration fixtures).
• Thermal design for compact enclosures.
• Certification exposure: STQC, FCC/CE.
• Direct EMS/CM relationship management.
• Drone PCB design experience.
Soft Skills
• Comfortable collaborating across India / Japan / Taiwan time zones.
• Coachable and able to mentor: takes design review feedback well; can guide junior and customer engineers.
• Self-driven field-support mindset: comfortable operating solo at a customer site with remote backup.
How to Apply
Please send your CV to anup.agrawal@dmprof.com with cc: to mohammed.iqbal.ahmed@dmprof.com
Show more Show less
Company: Digital Media Professionals Inc. (DMP), Japan
Location: India — co-located with our India Technical Lead for close day-to-day collaboration ([City])
Reports to: India Technical Lead
Engagement Type: Independent contractor / consulting engagement (full-time commitment)
Experience Level: Senior (5–8+ years)
Compensation: Competitive — to be discussed based on experience
About the Role
DMP's edge-AI camera SoC business in India is growing rapidly, with Indian customers developing production camera boards based on our Di1 platform and its EVB reference design. Today, software support is provided locally by our India FAE team, while hardware questions are handled by our hardware design team in Japan — adding turnaround delays across time zones.
We are engaging a hands-on senior hardware engineer in India to become the first line of hardware technical support for our Indian customers. Your primary mission is reviewing customer-designed boards and supporting them through to production. Looking ahead, DMP may also develop Di1-based boards using Indian board design vendors, and you would be the technical lead for that engagement. You will propose custom board designs based on our reference platform and physically debug and rework boards in the lab and at customer sites. You will work under the direction of the India Technical Lead, in close coordination with DMP's hardware design team in Japan and our SoC partner in Taiwan. The role is focused on customers in India, with potential involvement in Japan-side projects in the future.
Key Responsibilities
• Customer schematic & layout review (primary): Review customer schematics and PCB layouts for Di1-based camera boards against the hardware application note and reference design; issue written review reports (findings, severity, required corrections) and follow through to the next revision. Act as first-line hardware reviewer in India, escalating only complex or high-risk items to the Japan hardware team with clear, reproducible problem descriptions.
• Vendor technical management: Manage the technical engagement with customers' board design and manufacturing vendors: design guidance, review cycles, DFM/DFT feedback, EVT/DVT build support, and issue tracking to closure. In the future, act as the technical lead when DMP develops Di1-based boards with Indian board design vendors.
• Board development proposals: Propose custom board architectures derived from the EVB/DevKit reference design: block diagrams, component selection (DRAM, SPI NAND storage, audio codec, Ethernet PHY, power tree), and BOM cost/availability trade-offs for the Indian market.
• Hands-on bring-up, debug & rework: Bring up prototype boards; debug power sequencing, boot, sensor/MIPI, DDR, and Ethernet issues using oscilloscope, logic analyzer, and JTAG. Perform board rework by hand — fine-pitch soldering, SMD replacement (hot-air/iron), and jumper-wire rework — at our lab and at customer sites.
• Technical support & documentation: Answer customer hardware queries (interface design, part alternatives, compliance) with concise written responses; build local FAQ and known-issues documentation; define bring-up procedures and debug strategies together with firmware/BSP teams.
• Cross-site collaboration: Work across time zones with counterparts in India, Japan, and Taiwan. Domestic travel within India to customer and vendor sites is required.
Required Qualifications
• B.E./B.Tech in Electronics/Electrical Engineering, or equivalent practical experience.
• 5–8+ years of board design or in-depth design review experience in camera, embedded, or consumer/industrial electronics, including at least one product taken from schematic to mass production.
• Linux / Yocto BSP literacy for boot- and driver-level debug.
• Schematic capture and PCB layout review capability (Altium preferred; OrCAD/Cadence acceptable).
• High-speed digital design: impedance control, length matching, PCB stack-up definition.
• DDR memory interface design (DDR3/LPDDR3/DDR4/LPDDR4).
• Image sensor and ISP interface design: MIPI CSI-2, I2C sensor control.
• Ethernet PHY integration (RGMII).
• Multi-rail power design: PMIC selection, DC/DC + LDO sequencing (EN / power-good).
• Proven hands-on experience with oscilloscope-based hardware bring-up and debug (mandatory); working experience with logic analyzer and JTAG.
• Proven hands-on soldering experience: fine-pitch soldering and SMD rework on production-class boards.
• EMI/EMC/ESD compliance design fundamentals.
• DFM/DFT and production readiness: EVT/DVT, prototype builds, root-cause analysis.
• Customer-facing communication: explains hardware issues clearly to customers and engineering teams.
• Clear written communication in English: concise review reports, issue reports, and vendor queries — critical when working with teams a time zone away.
Preferred Experience
• Edge AI SoC / NPU platform experience (Ambarella, HiSilicon, Rockchip, Qualcomm edge, or similar).
• Reference design adaptation: taking an EVB/DevKit to a custom production board.
• New platform evaluation: assessing image sensors, ISPs, and SoCs for future designs.
• Secure boot hardware: OTP, secure element / TPM provisioning.
• Cross-functional interface definition with firmware/BSP, mechanical, and manufacturing teams.
• Signal integrity measurement with TDR / network analyzer.
Nice to Have
• CCTV / IP camera product background (ONVIF, RTSP).
• ISP tuning awareness — enough sensor–ISP understanding to isolate image issues to hardware.
• Stereo / depth camera hardware (dual-camera sync, calibration fixtures).
• Thermal design for compact enclosures.
• Certification exposure: STQC, FCC/CE.
• Direct EMS/CM relationship management.
• Drone PCB design experience.
Soft Skills
• Comfortable collaborating across India / Japan / Taiwan time zones.
• Coachable and able to mentor: takes design review feedback well; can guide junior and customer engineers.
• Self-driven field-support mindset: comfortable operating solo at a customer site with remote backup.
How to Apply
Please send your CV to anup.agrawal@dmprof.com with cc: to mohammed.iqbal.ahmed@dmprof.com
Show more Show less