LT

Full Chip Physical Design Architect

Accepting applications

LeadSoc Technologies Pvt Ltd · Bengaluru, Karnataka, India

Full-Time Mid_senior AICadenceDFTMentorPerl
Estimated market salary
₹20-36 LPA

This is a SiliconBoard market estimate, not an employer-posted salary.

Posted
3d ago
Category
Design
Experience
Mid_senior
Country
India
Full Chip Physical Design Architect
Location-Bengaluru
Exp-12+ Years
About the Role
We are seeking a visionary Full Chip Physical Design Architect to lead the architecture and execution of complex SoC physical design flows. As a Full Chip Physical Design Architect, you will define methodologies, drive innovation, and ensure successful tape-outs of cutting-edge silicon. This is a high-impact role that requires deep technical expertise, strategic thinking, and the ability to influence global engineering teams.

Responsibilities
Architecture & Strategy
Define full-chip physical design methodologies, flows, and best practices across advanced technology nodes.
Architect scalable solutions for floorplanning, partitioning, hierarchical design, and integration.
Drive innovation in automation, design closure strategies, and cross-domain optimizations.
Technical Leadership
Own end-to-end chip-level physical design including synthesis, place & route, timing closure, power optimization, and sign-off.
Lead design reviews, ensuring designs meet stringent performance, power, and area (PPA) targets.
Collaborate with RTL, verification, DFT, and packaging teams to deliver manufacturable designs.
Execution Excellence
Guide teams through timing, power, and signal integrity closure at full-chip scale.
Partner with EDA vendors to evaluate and deploy next-generation tools and methodologies.
Ensure successful tape-outs and silicon bring-up for complex SoCs.
Mentorship & Influence
Mentor engineers and managers, fostering a culture of technical excellence and innovation.
Represent the physical design organization in global forums, influencing design strategy across geographies.

Basic Qualifications
Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
12+ years of experience in SoC physical design, with significant expertise at full-chip level.
Proven track record of delivering multiple tape-outs in advanced nodes (7nm, 5nm, or below).
Deep expertise in industry-standard EDA tools (Synopsys, Cadence, Mentor).
Strong background in STA, power analysis, IR drop, electromigration, and physical verification.
Excellent communication, leadership, and problem-solving skills.

Preferred Qualifications
Experience architecting flows for large-scale, hierarchical SoCs.
Exposure to high-performance CPU/GPU/AI accelerator designs.
Strong scripting skills (Tcl, Python, Perl) for automation and methodology development.
Ability to thrive in fast-paced, ambiguous environments and drive clarity across teams.

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