BN
Etch Process Engineer – Semiconductor Wafer Fabrication
Accepting applicationsBest NanoTech · Ahmedabad, Gujarat, India
Full-Time Mid_senior EtchPlasma EtchWet Etch
Posted
4d ago
Category
Manufacturing
Experience
Mid_senior
Country
India
Etch Process Engineer Semiconductor Wafer Fabrication
Location: Ahmedabad, Gujarat, India
Work Mode: Onsite
Experience: 6- 15 Years
Role Overview
We are seeking an experienced Etch Process Engineer to develop, optimize, qualify, and sustain plasma and wet etching processes within an advanced semiconductor wafer fabrication facility. This position plays a critical role in transferring complex device designs into manufacturable semiconductor products by ensuring precise material removal, excellent profile control, high selectivity, and low defectivity across multiple process technologies.
The successful candidate will collaborate closely with Process Integration, Lithography, Thin Film, CMP, Implant, Metrology, Yield Engineering, Equipment Engineering, Manufacturing Operations, and Quality teams to support technology development, production ramp-up, and high-volume manufacturing.
Candidates should possess strong expertise in dry plasma etching, reactive ion etching (RIE), dielectric and metal etching, process characterization, defect reduction, and Statistical Process Control (SPC).
Role Objectives
Develop robust plasma etch processes for semiconductor manufacturing.
Achieve excellent critical dimension (CD) control and profile accuracy.
Improve yield through process optimization and defect reduction.
Support technology transfer and production ramp.
Deliver stable, repeatable, and scalable etch manufacturing processes.
Key Responsibilities
Develop, optimize, and sustain dry and wet etching processes for semiconductor wafer fabrication.
Establish process windows for dielectric, polysilicon, metal, oxide, nitride, silicon, and compound semiconductor etching.
Optimize plasma chemistry, RF power, pressure, gas flow, temperature, and chamber conditions.
Improve etch profile, anisotropy, selectivity, uniformity, and critical dimension control.
Minimize defects such as micro-loading, footing, bowing, notching, grass formation, residue, and particle contamination.
Perform Design of Experiments (DOE) to optimize process parameters.
Analyze metrology data, defect inspection reports, SEM images, CD measurements, and electrical test results.
Support Process Integration activities across Lithography, Thin Film, CMP, Diffusion, and Implant modules.
Collaborate with Equipment Engineering to improve tool performance, chamber matching, uptime, and repeatability.
Qualify new process gases, chamber hardware, consumables, and etch chemistries.
Support installation, qualification, and acceptance testing of new etch equipment.
Utilize Statistical Process Control (SPC) to monitor process stability and capability.
Perform root cause analysis for process excursions and yield losses.
Support Advanced Process Control (APC) implementation to improve manufacturing consistency.
Develop engineering specifications, operating procedures, and process documentation.
Participate in technology transfer and New Product Introduction (NPI) activities.
Improve throughput, cycle time, yield, and overall manufacturing productivity.
Ensure compliance with semiconductor quality systems, cleanroom protocols, and EHS standards.
Drive Lean Manufacturing and continuous improvement initiatives.
Key Responsibilities During Fab Startup
Support installation and qualification of plasma etch tools.
Develop baseline process recipes for production.
Establish chamber matching and qualification procedures.
Define process control plans and manufacturing specifications.
Qualify process gases and consumables.
Support engineering lots, pilot production, and technology transfer.
Develop standard operating procedures (SOPs) and work instructions.
Train production personnel on etch process control.
Support production readiness before high-volume manufacturing.
Drive process capability improvements during fab ramp-up.
Required Qualifications
Bachelor's or Master's degree in Electronics Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, Semiconductor Engineering, or a related discipline.
6 15 years of semiconductor wafer fabrication experience.
Strong hands-on expertise in plasma and wet etching processes.
Experience supporting high-volume semiconductor manufacturing.
Proven expertise in process optimization, technology transfer, and yield improvement.
Excellent analytical, troubleshooting, and communication skills.
Technical Skills Semiconductor Manufacturing
Semiconductor Wafer Fabrication
Front-End Manufacturing (FEOL)
CMOS Process Technology
High Volume Manufacturing (HVM)
Semiconductor Process Development
Technology Transfer
Process Qualification
New Product Introduction (NPI)
Etch Process Expertise
Plasma Etching
Dry Etching
Wet Etching
Reactive Ion Etching (RIE)
Inductively Coupled Plasma (ICP)
Deep Reactive Ion Etching (DRIE)
Silicon Etching
Oxide Etching
Nitride Etching
Polysilicon Etching
Metal Etching
Dielectric Etching
Contact Etch
Via Etch
Trench Etch
Spacer Etch
Ashing
Descum Process
Process Chemistry
Fluorine-Based Chemistry
Chlorine-Based Chemistry
Bromine Chemistry
Oxygen Plasma
Argon Plasma
Helium Cooling
Chamber Cleaning Chemistry
Endpoint Detection
Plasma Diagnostics
Etch Equipment
Experience With Leading Semiconductor Etch Platforms Such As
Lam Research Plasma Etch Systems
Applied Materials Centura Etch
TEL (Tokyo Electron) Etch Systems
Hitachi High-Tech Etch Equipment
ASM Process Systems
Oxford Instruments Plasma Systems
Process Engineering
Design of Experiments (DOE)
Statistical Process Control (SPC)
Process Capability (Cp/Cpk)
Root Cause Analysis
FMEA
Yield Improvement
Process Characterization
Defect Reduction
Chamber Matching
Process Window Development
Metrology
CD-SEM
Optical Inspection
Overlay Analysis
Surface Profilometry
Defect Inspection
Particle Inspection
Film Thickness Measurement
Cross-Section SEM
Critical Dimension Analysis
Data Analysis
JMP
Python
MATLAB
SQL
Microsoft Excel
Statistical Analysis
Data Visualization
Cross Functional Collaboration
The Etch Process Engineer Will Work Closely With
Process Integration Engineering
Lithography Engineering
Thin Film Engineering
CMP Engineering
Diffusion Engineering
Ion Implant Engineering
Equipment Engineering
Manufacturing Engineering
Yield Engineering
Metrology Engineering
Quality Engineering
Automation Engineering
Facilities Engineering
Failure Analysis
Product Engineering
Preferred Industry Experience
Experience In Semiconductor Manufacturing For
Logic Devices
Memory Devices
Foundry Manufacturing
Analog & Mixed-Signal ICs
RF Devices
Power Semiconductors
CMOS Technologies
Candidates with greenfield fab startup experience, advanced technology node experience, or high-volume manufacturing exposure are highly preferred.
#LI-SD1
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Location: Ahmedabad, Gujarat, India
Work Mode: Onsite
Experience: 6- 15 Years
Role Overview
We are seeking an experienced Etch Process Engineer to develop, optimize, qualify, and sustain plasma and wet etching processes within an advanced semiconductor wafer fabrication facility. This position plays a critical role in transferring complex device designs into manufacturable semiconductor products by ensuring precise material removal, excellent profile control, high selectivity, and low defectivity across multiple process technologies.
The successful candidate will collaborate closely with Process Integration, Lithography, Thin Film, CMP, Implant, Metrology, Yield Engineering, Equipment Engineering, Manufacturing Operations, and Quality teams to support technology development, production ramp-up, and high-volume manufacturing.
Candidates should possess strong expertise in dry plasma etching, reactive ion etching (RIE), dielectric and metal etching, process characterization, defect reduction, and Statistical Process Control (SPC).
Role Objectives
Develop robust plasma etch processes for semiconductor manufacturing.
Achieve excellent critical dimension (CD) control and profile accuracy.
Improve yield through process optimization and defect reduction.
Support technology transfer and production ramp.
Deliver stable, repeatable, and scalable etch manufacturing processes.
Key Responsibilities
Develop, optimize, and sustain dry and wet etching processes for semiconductor wafer fabrication.
Establish process windows for dielectric, polysilicon, metal, oxide, nitride, silicon, and compound semiconductor etching.
Optimize plasma chemistry, RF power, pressure, gas flow, temperature, and chamber conditions.
Improve etch profile, anisotropy, selectivity, uniformity, and critical dimension control.
Minimize defects such as micro-loading, footing, bowing, notching, grass formation, residue, and particle contamination.
Perform Design of Experiments (DOE) to optimize process parameters.
Analyze metrology data, defect inspection reports, SEM images, CD measurements, and electrical test results.
Support Process Integration activities across Lithography, Thin Film, CMP, Diffusion, and Implant modules.
Collaborate with Equipment Engineering to improve tool performance, chamber matching, uptime, and repeatability.
Qualify new process gases, chamber hardware, consumables, and etch chemistries.
Support installation, qualification, and acceptance testing of new etch equipment.
Utilize Statistical Process Control (SPC) to monitor process stability and capability.
Perform root cause analysis for process excursions and yield losses.
Support Advanced Process Control (APC) implementation to improve manufacturing consistency.
Develop engineering specifications, operating procedures, and process documentation.
Participate in technology transfer and New Product Introduction (NPI) activities.
Improve throughput, cycle time, yield, and overall manufacturing productivity.
Ensure compliance with semiconductor quality systems, cleanroom protocols, and EHS standards.
Drive Lean Manufacturing and continuous improvement initiatives.
Key Responsibilities During Fab Startup
Support installation and qualification of plasma etch tools.
Develop baseline process recipes for production.
Establish chamber matching and qualification procedures.
Define process control plans and manufacturing specifications.
Qualify process gases and consumables.
Support engineering lots, pilot production, and technology transfer.
Develop standard operating procedures (SOPs) and work instructions.
Train production personnel on etch process control.
Support production readiness before high-volume manufacturing.
Drive process capability improvements during fab ramp-up.
Required Qualifications
Bachelor's or Master's degree in Electronics Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, Semiconductor Engineering, or a related discipline.
6 15 years of semiconductor wafer fabrication experience.
Strong hands-on expertise in plasma and wet etching processes.
Experience supporting high-volume semiconductor manufacturing.
Proven expertise in process optimization, technology transfer, and yield improvement.
Excellent analytical, troubleshooting, and communication skills.
Technical Skills Semiconductor Manufacturing
Semiconductor Wafer Fabrication
Front-End Manufacturing (FEOL)
CMOS Process Technology
High Volume Manufacturing (HVM)
Semiconductor Process Development
Technology Transfer
Process Qualification
New Product Introduction (NPI)
Etch Process Expertise
Plasma Etching
Dry Etching
Wet Etching
Reactive Ion Etching (RIE)
Inductively Coupled Plasma (ICP)
Deep Reactive Ion Etching (DRIE)
Silicon Etching
Oxide Etching
Nitride Etching
Polysilicon Etching
Metal Etching
Dielectric Etching
Contact Etch
Via Etch
Trench Etch
Spacer Etch
Ashing
Descum Process
Process Chemistry
Fluorine-Based Chemistry
Chlorine-Based Chemistry
Bromine Chemistry
Oxygen Plasma
Argon Plasma
Helium Cooling
Chamber Cleaning Chemistry
Endpoint Detection
Plasma Diagnostics
Etch Equipment
Experience With Leading Semiconductor Etch Platforms Such As
Lam Research Plasma Etch Systems
Applied Materials Centura Etch
TEL (Tokyo Electron) Etch Systems
Hitachi High-Tech Etch Equipment
ASM Process Systems
Oxford Instruments Plasma Systems
Process Engineering
Design of Experiments (DOE)
Statistical Process Control (SPC)
Process Capability (Cp/Cpk)
Root Cause Analysis
FMEA
Yield Improvement
Process Characterization
Defect Reduction
Chamber Matching
Process Window Development
Metrology
CD-SEM
Optical Inspection
Overlay Analysis
Surface Profilometry
Defect Inspection
Particle Inspection
Film Thickness Measurement
Cross-Section SEM
Critical Dimension Analysis
Data Analysis
JMP
Python
MATLAB
SQL
Microsoft Excel
Statistical Analysis
Data Visualization
Cross Functional Collaboration
The Etch Process Engineer Will Work Closely With
Process Integration Engineering
Lithography Engineering
Thin Film Engineering
CMP Engineering
Diffusion Engineering
Ion Implant Engineering
Equipment Engineering
Manufacturing Engineering
Yield Engineering
Metrology Engineering
Quality Engineering
Automation Engineering
Facilities Engineering
Failure Analysis
Product Engineering
Preferred Industry Experience
Experience In Semiconductor Manufacturing For
Logic Devices
Memory Devices
Foundry Manufacturing
Analog & Mixed-Signal ICs
RF Devices
Power Semiconductors
CMOS Technologies
Candidates with greenfield fab startup experience, advanced technology node experience, or high-volume manufacturing exposure are highly preferred.
#LI-SD1
Show more Show less