Engineer, Design

Job description:

Position Summary:
Amkor Technology is currently hiring an IC package Design Engineer for its Tempe, AZ location. This position requires the ability to create high-quality IC package designs and detailed engineering drawings and help sustain multiple design-related activities within the Design Center.
Essential Duties and Responsibilities:
Design Laminate (BGA) and Wafer Level packages, determining design rules, design optimization/verification, and selecting package type for thermal, mechanical, and electrical aspects
Create detailed engineering drawings with little supervision
Utilize skills and experience to solve design problems and customer issues
Seek out opportunities to improve and advance design technology
Exercise responsibility when making design-related decisions
Create and sustain effective, productive, and quality partnerships between the design team and customers
Interact with Amkor Product Group & Sales teams to ensure customer requirements are met; interface with internal and external customers as required Create documentation and perform record-keeping
Lead by example while learning
Other duties as assigned
Required Qualifications:
This position requires a bachelor's degree in Electrical Engineering, Mechanical Engineering, or other relevant engineering disciplines
Demonstrated experience using CAD or equivalent software to create engineering drawings
Good verbal and written communication skills
Demonstrates the ability to efficiently complete tasks with minimal supervision
Must be self-motivated and team-oriented with the ability to meet aggressive schedules and able to work well in a team environment
Preferred Qualifications:
Semiconductor packaging experience is a plus
Experience using package design and simulation tools (Cadence APD, Cadence Sigrity, Siemens Expedition, Ansys HFSS, and CAM350)
PCB design experience is a plus
Working knowledge of GD&T practices is helpful
SI/PI experience is a plus
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