N
(Career Fair) Wafer Fab Integration Engineering Technician - Multiple Shifts
Accepting applicationsNokia · San Jose, CA
Full-Time Mid_senior depositionetch
Posted
3d ago
Category
Manufacturing
Experience
Mid_senior
Country
United States
Job Description
Job Summary
Nokia’s Photonic Integrated Circuit (PIC) wafer fabs in Sunnyvale and San Jose focus on the production and R&D of advanced Indium Phosphide (InP) semiconductor devices. As a Wafer Fab Integration Engineering Technician, you will play a critical role in supporting wafer fabrication processes, improving product quality, and reducing defects.
This position offers the opportunity to work closely with cross-functional engineering teams to troubleshoot complex process issues, enhance yield and reliability, and contribute to the ramp-up of a high-volume manufacturing facility in San Jose. You will be part of a collaborative environment that emphasizes teamwork, continuous learning, and cutting-edge semiconductor innovation.
How You Will Contribute And What You Will Learn
Key Responsibilities
Investigate root causes for production lots placed on hold and drive corrective actions
Troubleshoot performance issues and yield excursions within the wafer fabrication process
Support engineering tool qualifications and process validations
Assist engineers with failure analysis, including:
Visual inspections
CD-SEM measurements
Electrical IV testing
Profilometry depth measurements
Utilize Manufacturing Execution Systems (MES) to:
Collect and track data
Perform basic data analysis
Generate reports (e.g., PowerPoint presentations)
Monitor Statistical Process Control (SPC) charts and provide first-level response to out-of-control conditions
Coordinate and track qualification and development lots across fabrication, assembly, and test operations
Ensure compliance with PIC product quality systems and standards
Support next-generation PIC platform development, including technology transfer and production ramp
Collaborate with cross-functional teams to improve process integration, yield, and device performance
Work Schedule: Weekend day shift — Friday, Saturday, Sunday, and every other Thursday from 6:00 AM to 6:00 PM Weekday day shift — Monday, Tuesday, Wednesday, and every other Thursday from 6:00 AM to 6:00 PM
Key Skills And Experience
Minimum Qualifications & Requirements
Bachelor’s degree in Science, Engineering, or a related technical field
Minimum of 3 years of experience in a modern semiconductor fabrication environment (5+ years preferred)
Strong attention to detail with a high commitment to quality
Demonstrated problem-solving skills and ability to follow through on tasks
Self-motivated, with a willingness to learn and expand technical skills
Strong sense of ownership and accountability
Effective team player with strong verbal and written communication skills
Ability to manage multiple tasks, prioritize work, and meet deadlines
Proficiency in using computer systems and software tools for data analysis and reporting
Preferred Qualifications:
Experience with Indium Phosphide (InP) or Gallium Arsenide (GaAs) semiconductor processes
Familiarity with wafer fab processes such as photolithography, etch, deposition, and CVD
Show more Show less
Job Summary
Nokia’s Photonic Integrated Circuit (PIC) wafer fabs in Sunnyvale and San Jose focus on the production and R&D of advanced Indium Phosphide (InP) semiconductor devices. As a Wafer Fab Integration Engineering Technician, you will play a critical role in supporting wafer fabrication processes, improving product quality, and reducing defects.
This position offers the opportunity to work closely with cross-functional engineering teams to troubleshoot complex process issues, enhance yield and reliability, and contribute to the ramp-up of a high-volume manufacturing facility in San Jose. You will be part of a collaborative environment that emphasizes teamwork, continuous learning, and cutting-edge semiconductor innovation.
How You Will Contribute And What You Will Learn
Key Responsibilities
Investigate root causes for production lots placed on hold and drive corrective actions
Troubleshoot performance issues and yield excursions within the wafer fabrication process
Support engineering tool qualifications and process validations
Assist engineers with failure analysis, including:
Visual inspections
CD-SEM measurements
Electrical IV testing
Profilometry depth measurements
Utilize Manufacturing Execution Systems (MES) to:
Collect and track data
Perform basic data analysis
Generate reports (e.g., PowerPoint presentations)
Monitor Statistical Process Control (SPC) charts and provide first-level response to out-of-control conditions
Coordinate and track qualification and development lots across fabrication, assembly, and test operations
Ensure compliance with PIC product quality systems and standards
Support next-generation PIC platform development, including technology transfer and production ramp
Collaborate with cross-functional teams to improve process integration, yield, and device performance
Work Schedule: Weekend day shift — Friday, Saturday, Sunday, and every other Thursday from 6:00 AM to 6:00 PM Weekday day shift — Monday, Tuesday, Wednesday, and every other Thursday from 6:00 AM to 6:00 PM
Key Skills And Experience
Minimum Qualifications & Requirements
Bachelor’s degree in Science, Engineering, or a related technical field
Minimum of 3 years of experience in a modern semiconductor fabrication environment (5+ years preferred)
Strong attention to detail with a high commitment to quality
Demonstrated problem-solving skills and ability to follow through on tasks
Self-motivated, with a willingness to learn and expand technical skills
Strong sense of ownership and accountability
Effective team player with strong verbal and written communication skills
Ability to manage multiple tasks, prioritize work, and meet deadlines
Proficiency in using computer systems and software tools for data analysis and reporting
Preferred Qualifications:
Experience with Indium Phosphide (InP) or Gallium Arsenide (GaAs) semiconductor processes
Familiarity with wafer fab processes such as photolithography, etch, deposition, and CVD
Show more Show less
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