ASIC Tape-Out / Customer Interface Engineer (TSMC, FinFET)

We’re hiring for a full-time opportunity with a leading semiconductor R&D organization in USA. This role focuses on TSMC advanced node tape-outs (FinFET), customer engagement, and backend sign-off flows. Detailed job description is given below. Title: ASIC Tape-Out / Customer Interface Engineer (TSMC, FinFET) Location: Lafayette, Indiana

Type: Full time with Client

Job Responsibilities

Act as the primary interface between customers and semiconductor foundries to ensure successful tape-outs
Guide customers through design sign-off, including sharing required documentation and technical requirements
Collaborate with internal design, layout, and engineering teams to ensure manufacturability
Prepare, review, and validate designs for fabrication using EDA tools
Support customer engagements by providing technical expertise during pre-sales and project execution
Partner with customers throughout the chip design and manufacturing lifecycle to ensure a smooth experience
Coordinate with foundry partners (primarily TSMC) on specifications, timelines, and fabrication requirements
Track project milestones and drive on-time delivery
Maintain accurate documentation of project status, customer communication, and technical details
Identify and implement process improvements and automation opportunities

Must-Have Skills & Experience

Proven tape-out experience with advanced TSMC nodes (e.g., FinFET technologies)
Strong understanding of semiconductor backend processes
Experience working directly with customers and external partners
Excellent communication skills (written and verbal)
Ability to manage multiple priorities and solve complex technical issues
Proactive, detail-oriented, and team-oriented mindset
Familiarity with Linux environments
Basic scripting or programming experience
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