T
Advanced Packaging Engineer – Thermo-Mechanical
Accepting applicationsTeradar · San Jose, CA
Full-Time Mid_senior RFSoC
Posted
2d ago
Category
Packaging
Experience
Mid_senior
Country
United States
Teradar is pioneering a new era in perception with the world’s first automotive terahertz vision sensor, delivering ultra-high-resolution imaging in any weather condition. Founded in Boston, Teradar’s solid-state, chip-scale technology unlocks safer, smarter vehicles and opens the door to transformative applications in mobility, defense, and beyond.
We are looking to hire an IC Packaging Engineer who will own the development and delivery of advanced packaging solutions for THz system RFIC & SoC applications. This is a high-impact role that combines technical leadership, hands-on thermo-mechanical and physical design, and vendor management to bring cutting-edge multi-chip packages into production.
Responsibilities
Technical leadership, guiding and personally executing the physical and structural design of advanced IC packages for multi-chip RFIC/SoC integration.
Develop 2.5D packages with UCIe chip-to-chip interconnects and interposer-based solutions.
Work on single-sided and double-sided RDL designs and on-package RF antenna structures.
Hands-on execution of structural, warpage, and thermal simulations using tools such as ANSYS to ensure package integrity under harsh automotive conditions.
Co-optimize package designs for thermal, mechanical, and physical layout performance, collaborating closely with dedicated internal SIPI, RFIC, and digital teams.
Drive material selection, DFM, and reliability qualification to meet automotive-grade requirements (AEC-Q).
Maintain and leverage relationships with OSATs, substrate suppliers, and ecosystem partners to accelerate development.
Create and review detailed mechanical analysis and drawings, substrate stack-ups, physical layout constraints, and co-review electrical performance boundaries.
Lead failure analysis and root cause investigations for packaging and reliability issues and provide structural solutions to increase yield.
Contribute to the packaging roadmap and scalability plan for automotive volume production.
Key Qualifications
10+ years of experience in IC packaging design and development, including leadership responsibilities and a strong track record of hands-on physical and mechanical design execution.
Proven track record with multi-chip packages, digital + RF integration, and automotive applications.
Deep expertise in thermo-mechanical management, mechanical stress analysis, warpage control, and package reliability modeling.
Proficient in Flip-Chip, Fan-Out, 2.5D integration, and heterogeneous system-in-package solutions.
Deep knowledge of UCIe interconnects, organic substrates, interposers, and advanced packaging architectures.
Experience with RF antenna integration in package designs.
Strong working knowledge of package electrical layouts and layout constraints, with the ability to bridge physical designs with SIPI requirements.
Established network with packaging vendors and OSATs.
M.S. or Ph.D. in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.
Excellent communication skills and ability to thrive in a fast-paced start-up environment.
Why Join
Technical oversight and design execution, defining packaging solutions for breakthrough ADAS technology.
Collaborate with a world-class engineering team spanning RFIC, SoC, and system design.
Be part of a well-funded start-up bringing innovative sensing technology to market.
Competitive compensation, stock options, and flexible work arrangements.
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We are looking to hire an IC Packaging Engineer who will own the development and delivery of advanced packaging solutions for THz system RFIC & SoC applications. This is a high-impact role that combines technical leadership, hands-on thermo-mechanical and physical design, and vendor management to bring cutting-edge multi-chip packages into production.
Responsibilities
Technical leadership, guiding and personally executing the physical and structural design of advanced IC packages for multi-chip RFIC/SoC integration.
Develop 2.5D packages with UCIe chip-to-chip interconnects and interposer-based solutions.
Work on single-sided and double-sided RDL designs and on-package RF antenna structures.
Hands-on execution of structural, warpage, and thermal simulations using tools such as ANSYS to ensure package integrity under harsh automotive conditions.
Co-optimize package designs for thermal, mechanical, and physical layout performance, collaborating closely with dedicated internal SIPI, RFIC, and digital teams.
Drive material selection, DFM, and reliability qualification to meet automotive-grade requirements (AEC-Q).
Maintain and leverage relationships with OSATs, substrate suppliers, and ecosystem partners to accelerate development.
Create and review detailed mechanical analysis and drawings, substrate stack-ups, physical layout constraints, and co-review electrical performance boundaries.
Lead failure analysis and root cause investigations for packaging and reliability issues and provide structural solutions to increase yield.
Contribute to the packaging roadmap and scalability plan for automotive volume production.
Key Qualifications
10+ years of experience in IC packaging design and development, including leadership responsibilities and a strong track record of hands-on physical and mechanical design execution.
Proven track record with multi-chip packages, digital + RF integration, and automotive applications.
Deep expertise in thermo-mechanical management, mechanical stress analysis, warpage control, and package reliability modeling.
Proficient in Flip-Chip, Fan-Out, 2.5D integration, and heterogeneous system-in-package solutions.
Deep knowledge of UCIe interconnects, organic substrates, interposers, and advanced packaging architectures.
Experience with RF antenna integration in package designs.
Strong working knowledge of package electrical layouts and layout constraints, with the ability to bridge physical designs with SIPI requirements.
Established network with packaging vendors and OSATs.
M.S. or Ph.D. in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.
Excellent communication skills and ability to thrive in a fast-paced start-up environment.
Why Join
Technical oversight and design execution, defining packaging solutions for breakthrough ADAS technology.
Collaborate with a world-class engineering team spanning RFIC, SoC, and system design.
Be part of a well-funded start-up bringing innovative sensing technology to market.
Competitive compensation, stock options, and flexible work arrangements.
Show more Show less