Advanced Hardware Engr

Qualifications

Advanced ECAD Hardware Engineer

We are seeking a highly skilled and experienced Advanced ECAD Hardware Engineer to lead, optimize, and execute advanced hardware design activities within the engineering design environment. This role is responsible for developing complex, high-speed, multilayer Printed Circuit Board designs from concept through manufacturing release, ensuring that designs meet performance, reliability, manufacturability, and quality requirements.

Key Responsibilities

PCB Layout and Concept Development: Create high-density, multilayer, rigid, and rigid-flex PCB layouts optimized for signal integrity, power distribution, thermal performance, and manufacturability.
DFx Compliance: Perform advanced Design for Manufacturing, Design for Assembly, and Design for Test reviews using integrated tools such as Valor NPI to minimize design iterations, reduce engineering changes, and support efficient production release.
Documentation and PLM Control: Manage engineering documentation, Bill of Materials generation, and Engineering Change Notices while supporting release workflows through Siemens Teamcenter or equivalent PLM systems.
Cross-Functional Collaboration: Participate in hardware design reviews, risk mitigation activities, and technical discussions with electrical, mechanical, sourcing, manufacturing, and fabrication vendor teams.
Mentorship and Workflow Optimization: Provide technical guidance to junior engineers and support CAD process improvements, tool migration initiatives, and scripting or automation activities to improve design efficiency.

Required Technical Skills

Strong expertise in Siemens EDA Xpedition, including xDX Designer, xPCB Layout, Constraint Manager, and related ECAD design workflows.
Hands-on experience with PCB design verification and manufacturing review tools such as Valor and ViewMate.
Experience in schematic capture, board layout, constraint-driven design, and manufacturing data generation.
Working knowledge of PLM systems such as Siemens Teamcenter for documentation control, BOM management, and release processes.
Solid understanding of high-speed design practices, power distribution, thermal considerations, and PCB fabrication and assembly constraints.

Required Qualifications

Bachelor’s degree in Electronics, Electrical Engineering, or a related engineering discipline; equivalent practical experience may also be considered.
Proven experience in advanced ECAD design for complex hardware products, preferably involving high-speed, high-density, or multilayer PCB designs.
Demonstrated ability to work with cross-functional teams and external fabrication or assembly vendors to resolve design and manufacturing issues.
Experience supporting design reviews, engineering releases, and production readiness activities.

Professional Competencies

Strong analytical, diagnostic, and technical problem-solving skills.
Clear communication skills with the ability to translate complex technical constraints across diverse engineering teams.
Attention to detail and commitment to quality, documentation accuracy, and design process compliance.
Ability to mentor junior team members and contribute to a culture of continuous improvement.

About Us

Honeywell helps organizations solve the world's most complex challenges in automation, the future of aviation and energy transition. As a trusted partner, we provide actionable solutions and innovation through our Aerospace Technologies, Building Automation, Energy and Sustainability Solutions, and Industrial Automation business segments – powered by our Honeywell Forge software – that help make the world smarter, safer and more sustainable.
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